Patents by Inventor Hugo Enrique Cuadras

Hugo Enrique Cuadras has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9583805
    Abstract: An RF filter assembly comprising a substrate, an RF waveguide filter mounted on the substrate and a pair of alignment/mounting/RF signal transmission pins extending from respective apertures in the substrate into respective through-holes in the RF filter. In one embodiment, the RF waveguide filter is comprised of first and second blocks of dielectric material coupled together in an abutting side-by-side relationship and the pair of through-holes are defined in the first and second blocks respectively. In one embodiment, respective RF signal transmission pads defined on the respective first and second blocks of dielectric material are abutted against respective RF signal transmission pads defined on the substrate and interconnected by an RF signal transmission line in the interior of the substrate for transmitting the RF signal between the first and second blocks of dielectric material.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: February 28, 2017
    Assignee: CTS Corporation
    Inventors: Hugo Enrique Cuadras, Nam Phan
  • Publication number: 20150207193
    Abstract: An RF filter assembly comprising a substrate, an RF waveguide filter mounted on the substrate and a pair of alignment/mounting/RF signal transmission pins extending from respective apertures in the substrate into respective through-holes in the RF filter. In one embodiment, the RF waveguide filter is comprised of first and second blocks of dielectric material coupled together in an abutting side-by-side relationship and the pair of through-holes are defined in the first and second blocks respectively. In one embodiment, respective RF signal transmission pads defined on the respective first and second blocks of dielectric material are abutted against respective RF signal transmission pads defined on the substrate and interconnected by an RF signal transmission line in the interior of the substrate for transmitting the RF signal between the first and second blocks of dielectric material.
    Type: Application
    Filed: April 1, 2015
    Publication date: July 23, 2015
    Inventors: Hugo Enrique Cuadras, Nam Phan