Patents by Inventor Hugo F. Menschaar

Hugo F. Menschaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s)
    Patent number: 6588308
    Abstract: The invention relates to a method and a device for separating products mounted on a common substrate, from each other, along (a) cutting line(s). The products each comprise one or more chips present on said substrate and connecting means connected thereto, the connecting ends remote from the chip of which are provided with solder balls bonded thereto. The products are clamped down on a supporting element by using a sub-atmospheric pressure, and the supporting element and a rotary cutting blade are moved relative to each other along the intended cutting line so as to cut through the substrate. A liquid is supplied at the location of said cutting line on either side of the substrate.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: July 8, 2003
    Assignee: Meco Equipment Engineers B.V.
    Inventors: Joerg W. Rischke, Hugo F. Menschaar, Wilhelmus G. L. Van Sprang
  • Method and device for separating products, mounted on a common substrate, from each other along (a) cutting lines(s)
    Publication number: 20010029820
    Abstract: The invention relates to a method and a device for separating products mounted on a common substrate, from each other, along (a) cutting line(s). The products each comprise one or more chips present on said substrate and connecting means connected thereto, the connecting ends remote from the chip of which are provided with solder balls bonded thereto. The products are clamped down on a supporting element by using a sub-atmospheric pressure, and the supporting element and a rotary cutting blade are moved relative to each other along the intended cutting line so as to cut through the substrate. A liquid is supplied at the location of said cutting line on either side of the substrate.
    Type: Application
    Filed: November 29, 1999
    Publication date: October 18, 2001
    Inventors: Jorg W. Rischke, Hugo F. Menschaar, Wilhelmus G.L. Van Sprang