Patents by Inventor Hugo Piguet

Hugo Piguet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Production of edible wafers by extrusion
    Patent number: 8293308
    Abstract: A method for producing wafers by extrusion comprising the steps of a. Preparing an ingredient mix b. Feeding the mix in an extruder and cooking the mix c. Extruding the cooked mix such that an extruded and expanded non-planar structure is formed d. Unfolding the structure to give a large extruded sheet e. Subjecting the extruded sheet to stretching/pulling f. Adjusting the sheet in order to obtain a desired thickness g. Drying the sheet h. Separating the sheet into wafers of desired dimensions The invention also relates to the wafers thus produced and to a wafer production line.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: October 23, 2012
    Assignee: Nestec S.A.
    Inventors: Christophe Dautremont, Rodolfo De Acutis, Hugo Piguet
  • Edible wafer products produced by extrusion
    Patent number: 8087300
    Abstract: The present invention relates to edible wafers, in particular to extruded wafers and to the use of these wafers in confectionery.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: January 3, 2012
    Assignee: Nestec S.A.
    Inventors: Christophe Dautremont, Rodolfo De Acutis, Hugo Piguet
  • EDIBLE WAFER PRODUCTS PRODUCED BY EXTRUSION
    Publication number: 20100037699
    Abstract: The present invention relates to edible wafers, in particular to extruded wafers and to the use of these wafers in confectionery.
    Type: Application
    Filed: September 10, 2007
    Publication date: February 18, 2010
    Applicant: NESTEC S.A.
    Inventors: Christophe Dautremont, Rodolfo De Acutis, Hugo Piguet
  • PRODUCTION OF EDIBLE WAFERS BY EXTRUSION
    Publication number: 20090317524
    Abstract: A method for producing wafers by extrusion comprising the steps of a. Preparing an ingredient mix b. Feeding the mix in an extruder and cooking the mix c. Extruding the cooked mix such that an extruded and expanded non-planar structure is formed d. Unfolding the structure to give a large extruded sheet e. Subjecting the extruded sheet to stretching/pulling f. Adjusting the sheet in order to obtain a desired thickness g. Drying the sheet h. Separating the sheet into wafers of desired dimensions The invention also relates to the wafers thus produced and to a wafer production line.
    Type: Application
    Filed: September 10, 2007
    Publication date: December 24, 2009
    Applicant: NESTEC S.A.
    Inventors: Christophe Dautremont, Rodolfo De Acutis, Hugo Piguet