Patents by Inventor Hugo Rothuizen
Hugo Rothuizen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090003188Abstract: A data storage device comprises a storage medium for storing data in the form of marks and at least one probe for scanning the storage medium. The storage medium may be comprised in a substrate. The probe comprises a cantilever that comprises terminals serving as electrical contacts an being during operation of the probe mechanically fixed to a probe-holding structure, which may be a common frame of the data storage device. A probe further comprises a supporting structure, to which the terminals are mechanically directly coupled or coupled via hinges and which extends away from the terminals. A tip with a nanoscale apex is provided. A beam structure comprises a heating resistor and is attached at ends to the supporting structure. The beam structure is thinned at least in a direction parallel to an axis of the tip compared to an area of the supporting structure abutting the beam structure.Type: ApplicationFiled: March 25, 2008Publication date: January 1, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas Albrecht, Michel Despont, Urs T. Duerig, Mark Lantz, Hugo Rothuizen, Dorothea W. Wiesmann Rothuizen
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Publication number: 20080013437Abstract: A data storage device comprises a storage medium for storing data in the form of marks and at least one probe for scanning the storage medium. The storage medium may be comprised in a substrate. The probe comprises a cantilever that comprises terminals serving as electrical contacts an being during operation of the probe mechanically fixed to a probe-holding structure, which may be a common frame of the data storage device. A probe further comprises a supporting structure, to which the terminals are mechanically directly coupled or coupled via hinges and which extends away from the terminals. A tip with a nanoscale apex is provided. A beam structure comprises a heating resistor and is attached at ends to the supporting structure. The beam structure is thinned at least in a direction parallel to an axis of the tip compared to an area of the supporting structure abutting the beam structure.Type: ApplicationFiled: January 13, 2006Publication date: January 17, 2008Inventors: Thomas Albrecht, Michel Despont, Urs Duerig, Mark Lantz, Hugo Rothuizen, Dorothea Wiesmann Rothuizen
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Publication number: 20070230133Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.Type: ApplicationFiled: March 30, 2006Publication date: October 4, 2007Applicant: International Business Machines CorporationInventors: Bruno Michel, Thomas Brunschwiler, Ryan Linderman, Hugo Rothuizen, Urs Kloter
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Publication number: 20070119565Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.Type: ApplicationFiled: November 13, 2006Publication date: May 31, 2007Applicant: International Business Machines CorporationInventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
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Publication number: 20070017659Abstract: A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.Type: ApplicationFiled: June 28, 2006Publication date: January 25, 2007Applicant: International Business Machines CorporationInventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
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Publication number: 20060286712Abstract: An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.Type: ApplicationFiled: May 19, 2006Publication date: December 21, 2006Applicant: International Business Machines CorporationInventors: Thomas Brunschwiler, Urs Kloter, Ryan Linderman, Bruno Michel, Hugo Rothuizen
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Publication number: 20050281174Abstract: The present invention provides data storage devices, systems and methods. An example device includes: a storage medium for storing data in the form of marks; and at least one probe. The probe(s) and storage medium are operable to move relative to each other, with each probe comprising a tip facing the storage medium and having a force creating unit associated thereto. The force creating units are operable to create a force acting between the tip and said storage medium. The data storage device is operable to erase an indentation mark in the storage medium by way of controlling the force creating unit for creating at least one erase force pulse with a force rise time being less than or equal to the order of 1 microsecond.Type: ApplicationFiled: June 22, 2005Publication date: December 22, 2005Applicant: International Business Machines CorporationInventors: Bernd Gotsmann, Urs Duerig, Charalamoos Pozidie, Hugo Rothuizen, Gerd Binnig
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Publication number: 20050263879Abstract: The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.Type: ApplicationFiled: June 1, 2005Publication date: December 1, 2005Applicant: International Business Machines CorporationInventors: Bruno Michel, Thomas Brunschwiler, Hugo Rothuizen, Urs Kloter
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Publication number: 20050124092Abstract: The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.Type: ApplicationFiled: May 28, 2003Publication date: June 9, 2005Inventors: Gian-Luca Bona, Bruno Michel, Hugo Rothuizen, Peter Vettiger, Han Biebuyck