Patents by Inventor Hui Bin Huang

Hui Bin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11667061
    Abstract: The invention provides a method of forming porous polyurethane polishing pad that includes feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web. Coagulating liquid polyurethane onto the web sheet forms a two-layer substrate. The two-layer substrate has a porous matrix wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface. Spring-arm sections connect lower and upper sections of the large pores.
    Type: Grant
    Filed: April 18, 2020
    Date of Patent: June 6, 2023
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Wei-Wen Tsai, Katsumasa Kawabata, Hui Bin Huang, Akane Uehara, Yosuke Takei
  • Publication number: 20210323115
    Abstract: The invention provides a porous polyurethane polishing pad that includes a porous matrix. The matrix has large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with tertiary pores, a portion of the large pores is open to a top polishing surface and at least a portion of the large pores extend to the top polishing surface. Spring-arm sections connect lower and upper sections of the large pores. The spring-arm sections all are in a same horizontal direction as measured from the vertical orientation and they combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.
    Type: Application
    Filed: April 18, 2020
    Publication date: October 21, 2021
    Inventors: Wei-Wen TSAI, Katsumasa KAWABATA, Hui Bin HUANG, Akane UEHARA, Yosuke TAKEI
  • Publication number: 20210323116
    Abstract: The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientation. The lower and upper sections are offset in a horizontal direction. Middle-sized pores with a columnar shape and a vertical orientation originate adjacent the middle sections and small pores with a columnar shape and a vertical orientation originate between the middle-sized pores. The pores combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.
    Type: Application
    Filed: April 18, 2020
    Publication date: October 21, 2021
    Inventors: Wei-Wen TSAI, Katsumasa KAWABATA, Hui Bin HUANG, Akane UEHARA, Yosuke TAKEI
  • Publication number: 20210323202
    Abstract: The invention provides a method of forming porous polyurethane polishing pad that includes feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web. Coagulating liquid polyurethane onto the web sheet forms a two-layer substrate. The two-layer substrate has a porous matrix wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface. Spring-arm sections connect lower and upper sections of the large pores.
    Type: Application
    Filed: April 18, 2020
    Publication date: October 21, 2021
    Inventors: Wei-Wen TSAI, Katsumasa KAWABATA, Hui Bin HUANG, Akane UEHARA, Yosuke TAKEI
  • Patent number: 10259099
    Abstract: The method forms a porous polyurethane polishing pad by coagulating thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. Heating a press to temperature below or above the softening onset temperature of the thermoplastic polyurethane forms a series of pillows. Plastic deforming side walls of the pillow structures forms downwardly sloped side walls. The downwardly sloped side walls extend from all sides of the pillow structures. The large pores open to the downwardly sloped sidewalls are less vertical than the large pores open to the top polishing surface and are offset 10 to 60 degrees from the vertical direction.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: April 16, 2019
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo
  • Patent number: 9925637
    Abstract: The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a downward surface extending from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface. The large pores open to the downwardly sloped sidewalls and are less vertical than the large pores. The large pores are offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: March 27, 2018
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo
  • Publication number: 20180036860
    Abstract: The method forms a porous polyurethane polishing pad by coagulating thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. Heating a press to temperature below or above the softening onset temperature of the thermoplastic polyurethane forms a series of pillows. Plastic deforming side walls of the pillow structures forms downwardly sloped side walls. The downwardly sloped side walls extend from all sides of the pillow structures. The large pores open to the downwardly sloped sidewalls are less vertical than the large pores open to the top polishing surface and are offset 10 to 60 degrees from the vertical direction.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 8, 2018
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo
  • Publication number: 20180036862
    Abstract: The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a downward surface extending from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface. The large pores open to the downwardly sloped sidewalls and are less vertical than the large pores. The large pores are offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 8, 2018
    Inventors: Koichi Yoshida, Kazutaka Miyamoto, Katsumasa Kawabata, Henry Sanford-Crane, Hui Bin Huang, George C. Jacob, Shuiyuan Luo