Patents by Inventor Hui Chen

Hui Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8918676
    Abstract: Disclosed in the present invention are a method and an apparatus for restarting communication after registration of a subscriber identity module SIM card fails, which belongs to the field of mobile communications. The method includes: acquiring failure information about registration of the SIM card; displaying the failure information and prompt information on an interface, and receiving confirmation information that is replied by a user according to the prompt information; and restarting, according to the confirmation information, a communication processor under the condition of not turning off an application processor or not restarting the application processor, so as to re-register the SIM card.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: December 23, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Hui Chen
  • Patent number: 8915178
    Abstract: A minute pressure grill includes an upper grill unit and a lower grill unit. It further includes a U-shaped lift pole, which is rotately connected to the two sides of the upper grill unit. The two ends of the U-shaped lift pole are separately disposed with a first cavity. The first cavity is disposed with a pressure spring and a J-shaped lock catch to drive the pressure spring to compress or release. A pair of arc lead rails are disposed separately on the two sides of the lower grill unit. With the rotation of the J-shaped lock catch inside the U-shaped front pole and the J-shaped lock catch is compressed tightly to the arc lead rails, the food is pressed by the upper grill unit. The food is pressed with the cooperation of the pressure spring and the lock catch.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: December 23, 2014
    Assignee: Tsann Kuen (Zhangzhou) Enterprise Co., Ltd.
    Inventors: Hui Chen, Yueqing Chen
  • Publication number: 20140369381
    Abstract: A circuit includes a comparator unit and a switching network. The comparator unit is configured to receive a first voltage value, a second voltage value and a third voltage value of a voltage node, and to provide a control signal. The switching network includes the voltage node and is configured to operate in a first condition or in a second condition based on the control signal. Based on the first condition, the voltage node is configured to have a voltage value increase to the first voltage value.
    Type: Application
    Filed: June 17, 2013
    Publication date: December 18, 2014
    Inventors: Jaw-Juinn HORNG, Szu-Lin LIU, Chung-Hui CHEN
  • Publication number: 20140368715
    Abstract: A turbulence-free CCD camera system with nonclassical imaging resolution, for applications in long- distance imaging, such as satellite and aircraft-to-ground based distant imaging, utilizing an intensity- fluctuation correlation measurement of thermal light. The proposed camera system has the following advantages over classic imaging technology: (1) it is turbulence-free; (2) its spatial resolution is mainly determined by the angular diameter of the light source. For example, using sun as the light source, this camera may achieve a spatial resolution of 200 micrometer for any object on Earth. 200-micrometer resolution is insignificant for short distance imaging, however, taking a picture of a target at 10-kilometer, a classic camera must have a lens of 90-meter diameter in order to achieve 200-micrometer resolution.
    Type: Application
    Filed: June 17, 2014
    Publication date: December 18, 2014
    Inventors: Yanhua Shih, Hui Chen, Tao Peng
  • Publication number: 20140368264
    Abstract: A circuit includes a comparator unit, a capacitive device, and a switching network. The comparator unit is configured to set a control signal at a first logical value when an output voltage reaches a first voltage value from being less than the first voltage value, and to set the control signal at a second logical value when the output voltage reaches a second voltage value from being greater than the second voltage. The capacitive device provides the output voltage. The switching network is configured to charge or discharge the capacitive device based on the control signal.
    Type: Application
    Filed: February 28, 2014
    Publication date: December 18, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jaw-Juinn HORNG, Szu-Lin LIU, Chung-Hui CHEN
  • Publication number: 20140369552
    Abstract: A method of establishing an adjustable-block background model for detecting a real-time image object is provided to obtain a surveillance image by a surveillance apparatus. The surveillance image has a plurality of pixels. The method includes steps of: segmenting the surveillance image into a plurality of blocks each having a first pixel and at least one second pixel; defining the first pixel as a major color and comparing the first pixel with the at least one second pixel to determine a number and color information of the major color in the block; merging the blocks having the same major color into a large block to obtain a block background model; and performing image comparison to identify a moving object image. With the establishment of the block background model, a required memory space is effectively reduced while outstanding image display performance is still maintained.
    Type: Application
    Filed: June 14, 2013
    Publication date: December 18, 2014
    Inventors: Ming-Hwa SHEU, Wen-Kai TSAI, Jian-Hui CHEN
  • Patent number: 8911482
    Abstract: An interlocking bone plate system includes an outer bone plate for being arranged outside a broken bone, an inner bone plate for being installed inside the medullary cavity of the broken bone, and screws for being inserted through and engaged with the outer bone plate and the broken bone and then engaged with the inner bone plate so as to interlock the out and inner bone plates together. The inner bone plate provides an added support in addition to the support provided by the outer bone plate, enhancing the structural strength of the whole bone fixation structure and lowering the risk of failed surgery.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: December 16, 2014
    Assignee: Taichung Veterans General Hospital
    Inventors: Cheng-Hung Lee, Chih-Han Chang, Chih-Kun Hsiao, Kui-Chou Huang, Chih-Hui Chen
  • Publication number: 20140356543
    Abstract: The present invention provides a spray nozzle, configured with left and right halves, at least one of the left and right halves being defined with a mating surface in which a recess defining width of a linear opening of the nozzle is defined, each end of the nozzle being mounted with fenders jointly define the linear opening of the nozzle along with the recess, wherein the mating surface in which the recess is defined further includes with a N number of partitions dividing the recess into a N+1 number of individual ejectors, wherein N is a positive integer. The present invention is to divide a single mouth of a spray nozzle of larger dimension into a plurality of individual ejectors with smaller dimension. During the acceleration or reduction of the spray nozzle, each individual ejector will deliver a homogeneous and even quantity of working liquid at central and end portions.
    Type: Application
    Filed: June 27, 2013
    Publication date: December 4, 2014
    Inventors: Hui Chen, Chih-hao Chang, Wen-hua Wang, Chi-che Lin
  • Publication number: 20140354057
    Abstract: A resonant converter apparatus includes a first pre-regulator, a first resonant converter, a second pre-regulator, a second resonant converter and a controller. The first pre-regulator receives a first input voltage and generates a first output voltage. The first resonant converter receives the first output voltage and generates a supply voltage. The second pre-regulator receives a second input voltage and generates a second output voltage. The second resonant converter receives the second output voltage and generates the supply voltage, in which an output of the second resonant converter is electrically connected in parallel with an output of the first resonant converter. The controller controls the first pre-regulator and the second pre-regulator such that the first resonant converter and the second resonant converter generate identical output currents in accordance with controlled operations of the first pre-regulator and the second pre-regulator.
    Type: Application
    Filed: August 13, 2013
    Publication date: December 4, 2014
    Applicant: Delta Electronics, Inc.
    Inventors: Yun-Hui Chen, Zhi-Jiang Deng, Guo-Dong Yin, Zhong-Wei Ke
  • Publication number: 20140359345
    Abstract: The present invention provides a data storage device including a flash memory and a controller. The controller is configured to perform a first read operation to read a first page corresponding to a first word line of the flash memory according to a read command of a host, and perform a distribution-adjustment procedure when data read by the first read operation cannot be recovered by coding, wherein the controller is further configured to perform an adjustable read operation to read a second page corresponding to a second word line of the flash memory in the distribution-adjustment procedure.
    Type: Application
    Filed: May 7, 2014
    Publication date: December 4, 2014
    Applicant: Silicon Motion, Inc.
    Inventors: Chun-Yi CHEN, Chun-Hui CHEN
  • Publication number: 20140346670
    Abstract: A multilayer substrate includes a first outer conductive patterned layer, a first insulating layer exposing a portion of the first outer conductive patterned layer to define a first set of pads, a second outer conductive patterned layer, and a second insulating layer exposing a portion of the second outer conductive patterned layer to define a second set of pads. The multilayer substrate further includes inner layers each with an inner conductive patterned layer, multiple inner conductive posts formed adjacent to the inner conductive patterned layer, and an inner dielectric layer, where the inner conductive patterned layer and the inner conductive posts are embedded in the inner dielectric layer, and a top surface of each of the inner conductive posts is exposed from the inner dielectric layer.
    Type: Application
    Filed: August 6, 2014
    Publication date: November 27, 2014
    Inventors: Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh, Ming Chiang Lee, Bernd Karl Appelt
  • Publication number: 20140341030
    Abstract: A packet switch device includes an input port, a loop-back port, a storage module, and a switch engine. The input port receives a packet. The storage module stores packet flow tables. Each packet flow table includes at least one flow entry and action. The switch engine compares the packet with a default packet flow table of the plurality of packet flow tables when it determines that the packet does not include a flow header. The switch engine includes the packet with the flow entry of the default packet flow table and performs the corresponding action when the packet matches the flow entry. When the action includes a specific action of comparing the packet with another one of the packet flow tables, the switch engine attaches the flow header to the packet to set a flow ID therein and transmits the packet back to the switch engine through the loop-back port.
    Type: Application
    Filed: February 21, 2014
    Publication date: November 20, 2014
    Applicant: ACCTON TECHNOLOGY CORPORATION
    Inventor: Hui-Chen KUO
  • Publication number: 20140342643
    Abstract: A chemical mechanical polishing fixture having lateral perforation structures includes: a holder and a retaining ring. The holder includes: an annular substrate, a plurality of third holes and a plurality of lateral perforation structures. The annular substrate has a first joint surface, an outer periphery and an inner periphery. The third holes are annularly arranged on the first joint surface, and each third hole includes a first inner thread structure for individually providing a screw to be locked to a semiconductor machine. The lateral perforation structures penetrate from the outer periphery to the inner periphery of the annular substrate, where the lateral perforations are selected from: a converse U-shaped cube structure, an converse U-shaped cube structure, a cuboid structure, a cylinder structure, an elliptic cylinder structure, a flat cuboid structure or a hybrid structure of at least one cuboid structure and the above.
    Type: Application
    Filed: March 5, 2014
    Publication date: November 20, 2014
    Applicant: KAI FUNG TECHNOLOGY CO., LTD.
    Inventor: Hui-Chen YEN
  • Patent number: 8891313
    Abstract: A read operation for a memory device. In response to an input address indicating to read data from a different page, a selected word line, first and second global bit lines and a selected first bit line group are precharged. A first cell current flowing through the selected word line, the first and the selected first bit line groups is generated. A first reference current flowing through the second global bit line group is generated. A first half page data is read based on the first cell current and the first reference current. The selected word line, the first and the second global bit lines are kept precharged. A second cell current flowing through the selected word line is generated. A second reference current is generated. A second half page data is read based on the second cell current and the second reference current.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: November 18, 2014
    Assignee: Macronix International Co., Ltd.
    Inventors: Chin-Hung Chang, Chia-Jung Chen, Su-Chueh Lo, Ken-Hui Chen, Kuen-Long Chang
  • Publication number: 20140332983
    Abstract: A stacked chip package including a device substrate having an upper surface, a lower surface and a sidewall is provided. The device substrate includes a sensing region or device region, a signal pad region and a shallow recess structure extending from the upper surface toward the lower surface along the sidewall. A redistribution layer is electrically connected to the signal pad region and extends into the shallow recess structure. A wire has a first end disposed in the shallow recess structure and electrically connected to the redistribution layer, and a second end electrically connected to a first substrate and/or a second substrate disposed under the lower surface. A method for forming the stacked chip package is also provided.
    Type: Application
    Filed: July 23, 2014
    Publication date: November 13, 2014
    Inventors: Yen-Shih HO, Tsang-Yu LIU, Shu-Ming CHANG, Yu-Lung HUANG, Chao-Yen LIN, Wei-Luen SUEN, Chien-Hui CHEN
  • Publication number: 20140332908
    Abstract: A chip package including a chip is provided. The chip includes a sensing region or device region adjacent to an upper surface of the chip. A sensing array is located in the sensing region or device region and includes a plurality of sensing units. A plurality of first openings is located in the chip and correspondingly exposes the sensing units. A plurality of conductive extending portions is disposed in the first openings and is electrically connected to the sensing units, wherein the conductive extending portions extend from the first openings onto the upper surface of the chip. A method for forming the chip package is also provided.
    Type: Application
    Filed: July 23, 2014
    Publication date: November 13, 2014
    Inventors: Yen-Shih HO, Tsang-Yu LIU, Shu-Ming CHANG, Yu-Lung HUANG, Chao-Yen LIN, Wei-Luen SUEN, Chien-Hui CHEN, Ho-Yin YIU
  • Publication number: 20140332968
    Abstract: A chip package is provided. The chip package includes a chip having an upper surface, a lower surface and a sidewall. The chip includes a sensing region or device region and a signal pad region adjacent to the upper surface. A shallow recess structure is located outside of the signal pad region and extends from the upper surface toward the lower surface along the sidewall. The shallow recess structure has at least a first recess and a second recess under the first recess. A redistribution layer is electrically connected to the signal pad region and extends into the shallow recess structure. A first end of a wire is located in the shallow recess structure and is electrically connected to the redistribution layer. A second end of the wire is used for external electrical connection. A method for forming the chip package is also provided.
    Type: Application
    Filed: July 23, 2014
    Publication date: November 13, 2014
    Inventors: Yen-Shih HO, Tsang-Yu LIU, Shu-Ming CHANG, Yu-Lung HUANG, Chao-Yen LIN, Wei-Luen SUEN, Chien-Hui CHEN
  • Publication number: 20140331449
    Abstract: An adjustable door closer has a hollow pedestal with a first and a second chamber as well as an actuating groove. An actuating device is set into the actuating groove. A first piston assembly is set into the first chamber and a second piston assembly set into the second chamber. A partition wall is formed between the first and second chambers. Due to a laterally configured flow resistance unit, the holes to be set into the first and second chambers are reduced to three, including a no connecting hole and first and second backflow bypass holes, all of which are connected only to the second chamber from the partition wall. As such, the flow path structure is simplified compared to the five holes required for typical structures. The adjustable door closer could reduce significantly the manufacturing cost and realize better regulating functions with improved applicability and economic benefits.
    Type: Application
    Filed: May 8, 2013
    Publication date: November 13, 2014
    Applicant: HENG KUO CO., LTD
    Inventor: Hui-Chen Chang
  • Publication number: 20140332969
    Abstract: A chip package including a chip having an upper surface, a lower surface and a sidewall is provided. The chip includes a signal pad region adjacent to the upper surface. A first recess extends from the upper surface toward the lower surface along the sidewall. At least one second recess extends from a first bottom of the first recess toward the lower surface. The first and second recesses further laterally extend along a side of the upper surface, and a length of the first recess extending along the side is greater than that of the second recess extending along the side. A redistribution layer is electrically connected to the signal pad region and extends into the second recess. A method for forming the chip package is also provided.
    Type: Application
    Filed: July 23, 2014
    Publication date: November 13, 2014
    Inventors: Yen-Shih HO, Tsang-Yu LIU, Shu-Ming CHANG, Yu-Lung HUANG, Chao-Yen LIN, Wei-Luen SUEN, Chien-Hui CHEN, Chi-Chang LIAO
  • Patent number: 8884424
    Abstract: A multilayer substrate includes a first outer conductive patterned layer, a first insulating layer exposing a portion of the first outer conductive patterned layer to define a first set of pads, a second outer conductive patterned layer, and a second insulating layer exposing a portion of the second outer conductive patterned layer to define a second set of pads. The multilayer substrate further includes inner layers each with an inner conductive patterned layer, multiple inner conductive posts formed adjacent to the inner conductive patterned layer, and an inner dielectric layer, where the inner conductive patterned layer and the inner conductive posts are embedded in the inner dielectric layer, and a top surface of each of the inner conductive posts is exposed from the inner dielectric layer.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: November 11, 2014
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh, Ming Chiang Lee, Bernd Karl Appelt