Abstract: A film includes a removable base material, a resin layer and a plurality of arc elastomers. The resin layer is a partially-cured resin which is in a half-melting state with viscosity at a temperature higher than a first temperature and in a solid state without viscosity at a temperature lower than a second temperature, and the resin layer in a solid state is adhered on the base material. The arc elastomers are disposed inside the resin layer. The present invention further provides a chip packaging process using the film.