Abstract: Polymer blends, in particular polyphenylene ether-polyamide blends, are effectively compatibilized by incorporating under blending conditions certain oligomers, cooligomers, polymers and copolymers of narrow molecular weight distribution that are prepared under free radical polymerization conditions with glycidyl-functionalized nitroxyl initiators. The oligomers, cooligomers, polymers and copolymers contain at least one oxyamine group and at least one glycidyl-containing initiator group. The polymer blends have excellent mechanical properties.

Abstract: A method for positioning bond pads in a semiconductor die comprises the steps of (I) setting parameters including (a) setting a baseline pad pitch to a first value, (b) setting a first pad position equal to a first pad value and (c) providing a focal point; (II) determining a first angle between a first line through a center of the first pad position and the focal point and a second line through a center of the semiconductor die and normal to the edge; (III) determining a first pad spacing increment value equal to the first value divided by a cosine of the first angle; (IV) setting a second pad position equal to a second pad value, wherein the second pad value at least equals the first pad value plus the first value if both of the first bond pad and the second bond pad are ground pad or power pad with the same potential, else the second pad value at least equals the first pad value plus the first pad spacing increment value; and (V) using the first and second pad values to respectively position a first bond p

Abstract: A bonding method which prevents wire sweep and the wire structure thereof mainly provide the pre-shifted wire between the first bonding point and the second bonding point and counter to the mold flow from the side thus intensifying the strength of the wire structure and increasing the deformation space of the wire sustaining mold flow.

Abstract: A BGA package includes a chip with an array pad design disposed on the upper surface of a substrate. The chip has a plurality of bonding pads located about the periphery thereof, and the bonding pads of the chip are positioned in three rows, an inner row, a middle row, and an outer row along the sides of the chip. Only power supply pads and ground pads are designed to be located in the outer row of bonding pads, and all of the I/O pads are designed to be located in the middle row of the bonding pads and the inner row of the bonding pads.

Abstract: A roller skate includes three or more wheels rotatably supported in the lower portion. The front wheel is disengaged from the ground surface when the middle wheel and the rear wheel are in contact with the ground surface, and the rear wheel is disengaged from the ground surface when the middle wheel and the front wheel are in contact with the ground surface. The rear wheel is coupled to the front wheel so as to be driven by the front wheel when the rear wheel is elevated and is not in contact with the ground surface.

Abstract: A polymer composition containing a thermotropic liquid crystal polymer, polycarbonate and polyester. The polymer compositions are prepared by a two-step melt processing method which produces a unique microscopic morphology and improved toughness properties over conventional LCP blends.