Patents by Inventor Hui Chong Vince Ng

Hui Chong Vince Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lateral connection for a via-less thin film resistor
    Patent number: 8659085
    Abstract: The present disclosure is directed to an integrated circuit having a substrate and a first and a second interconnect structure over the substrate. Each interconnect structure has a first conductive layer over the substrate and a second conductive layer over the first conductive layer. The integrated circuit also includes a thin film resistor over a portion of the substrate between the first and the second interconnect structure that electrically connects the first conductive layers of the first and second interconnect structures.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: February 25, 2014
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: Hui Chong Vince Ng, Olivier Le Neel, Calvin Leung
  • LATERAL CONNECTION FOR A VIA-LESS THIN FILM RESISTOR
    Publication number: 20120049323
    Abstract: The present disclosure is directed to an integrated circuit having a substrate and a first and a second interconnect structure over the substrate. Each interconnect structure has a first conductive layer over the substrate and a second conductive layer over the first conductive layer. The integrated circuit also includes a thin film resistor over a portion of the substrate between the first and the second interconnect structure that electrically connects the first conductive layers of the first and second interconnect structures.
    Type: Application
    Filed: August 24, 2010
    Publication date: March 1, 2012
    Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
    Inventors: Hui Chong Vince Ng, Olivier Le Neel, Calvin Leung