Patents by Inventor Hui-Chuan Lai

Hui-Chuan Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7356931
    Abstract: A pair of hairdressing scissors, wherein a connecting block is mounted in the hairdressing scissor, on a first wall surface of the connecting block is protrusively formed a rib portion having a retaining ear thereof, and on a second wall surface of the connecting block is defined with a perforation thereof for engaging with the retaining ear, and an elastic member is mounted in the connecting block. Therefore, when the retaining ear of one pair of hairdressing scissors is engaged in the perforation of another pair of hairdressing scissors, the elastic member presses against the retaining ear, in this way, the pairs of hairdressing scissors can be coupled and positioned relative to one another firmly.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: April 15, 2008
    Inventor: Hui-Chuan Lai
  • Publication number: 20060213065
    Abstract: A pair of hairdressing scissors, wherein a connecting block is mounted in the hairdressing scissor, on a first wall surface of the connecting block is protrusively formed a rib portion having a retaining ear thereof, and on a second wall surface of the connecting block is defined with a perforation thereof for engaging with the retaining ear, and an elastic member is mounted in the connecting block. Therefore, when the retaining ear of one pair of hairdressing scissors is engaged in the perforation of another pair of hairdressing scissors, the elastic member presses against the retaining ear, in this way, the pairs of hairdressing scissors can be coupled and positioned relative to one another firmly.
    Type: Application
    Filed: March 23, 2006
    Publication date: September 28, 2006
    Inventor: Hui-Chuan Lai
  • Patent number: 6864670
    Abstract: A method for eliminating noise interference and acoustic noise by a printed circuit board ground plane layout is disclosed. The method is applied to a circuit system having multiple outputs, wherein the circuit system has a first power converting module, a second power converting module and a printed circuit board. The first power converting module and the second power converting module respectively includes a first ground pin group and a second ground pin group. The method includes the steps of (a) connecting each ground pin of the first ground pin group to a respective solder point and connecting each solder point to a first node, and connecting each ground pin of the second ground pin group to a respective solder point and connecting each solder point to a second node, and (b) connecting the first node and the second node to a common node and connecting the common node to a solder point of a common ground terminal on the printed circuit board ground plane.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: March 8, 2005
    Assignee: Delta Electronics, Inc.
    Inventors: Jr-Hong Ouyang, Hui-Chuan Lai, Jing-Cheng Lin
  • Publication number: 20040100233
    Abstract: A method for eliminating noise interference and acoustic noise by a printed circuit board ground plane layout is disclosed. The method is applied to a circuit system having multiple outputs, wherein the circuit system has a first power converting module, a second power converting module and a printed circuit board. The first power converting module and the second power converting module respectively includes a first ground pin group and a second ground pin group. The method includes the steps of (a) connecting each ground pin of the first ground pin group to a respective solder point and connecting each solder point to a first node, and connecting each ground pin of the second ground pin group to a respective solder point and connecting each solder point to a second node, and (b) connecting the first node and the second node to a common node and connecting the common node to a solder point of a common ground terminal on the printed circuit board ground plane.
    Type: Application
    Filed: May 21, 2003
    Publication date: May 27, 2004
    Applicant: Delta Electronics, Inc.,
    Inventors: Jr-Hong Ouyang, Hui-Chuan Lai, Jing-Cheng Lin