Patents by Inventor Hui-Chuan Wang

Hui-Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6322640
    Abstract: A method for forming a magnetically biased magnetoresistive (MR) layer. There is first provided a substrate. There is then formed over the substrate a ferromagnetic magnetoresistive (MR) material layer. There is then forming contacting the ferromagnetic magnetoresistive (MR) material layer a magnetic material layer formed of a first crystalline phase, where the magnetic material layer is formed of a crystalline multiphasic magnetic material having the first crystalline phase which does not appreciably antiferromagnetically exchange couple with the ferromagnetic magnetoresistive (MR) material layer and a second crystalline phase which does appreciably antiferromagnetically exchange couple with the ferromagnetic magnetoresistive (MR) material layer.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: November 27, 2001
    Assignee: Headway Technologies, Inc.
    Inventors: Rongfu Xiao, Chyu-Jiuh Torng, Hui-Chuan Wang, Jei-Wei Chang, Cherng-Chyi Han, Kochan Ju
  • Patent number: 6310751
    Abstract: A dual stripe magnetoresistive (DSMR) sensor element, and a method for fabricating the dual stripe magnetoresistive (DSMR) sensor element. When fabricating the dual stripe magnetoresistive (DSMR) sensor element while employing the method, there are employed two pair of patterned longitudinal magnetic biasing layers formed of a single longitudinal magnetic biasing material longitudinally magnetically biased in substantially anti-parallel directions. When longitudinally magnetically biasing the second pair of patterned longitudinal magnetic biasing layers there is employed a thermal annealing method employing a thermal annealing temperature, a thermal annealing exposure time and an extrinsic magnetic bias field strength such that the pair of longitudinally magnetically biased patterned first longitudinal magnetic biasing layers is not substantially demagnetized.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: October 30, 2001
    Assignee: Headway Technologies, Inc.
    Inventors: Yimin Guo, Kochan Ju, Hui-Chuan Wang, Simon H. Liao
  • Publication number: 20010021087
    Abstract: A dual stripe magnetoresistive (DSMR) sensor element, and a method for fabricating the dual stripe magnetoresistive (DSMR) sensor element. When fabricating the dual stripe magnetoresistive (DSMR) sensor element while employing the method, there are employed two pair of patterned magnetic biasing layers formed of a single magnetic biasing material. The two pair of patterned magnetic biasing layers bias a pair of patterned magneto resistive (MR) layers in a pair of opposite canted directions.
    Type: Application
    Filed: March 28, 2001
    Publication date: September 13, 2001
    Applicant: HEADWAY TECHNOLOGIES, INC.
    Inventors: Yimin Guo, Kochan Ju, Po-Kang Wang, Cherng-Chyi Han, Hui-Chuan Wang
  • Patent number: 6230390
    Abstract: A dual stripe magnetoresistive (DSMR) sensor element, and a method for fabricating the dual stripe magnetoresistive (DSMR) sensor element. When fabricating the dual stripe magnetoresistive (DSMR) sensor element while employing the method, there are employed two pair of patterned magnetic biasing layers formed of a single magnetic biasing material. The two pair of patterned magnetic biasing layers bias a pair of patterned magnetoresistive (MR) layers in a pair of opposite canted directions.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: May 15, 2001
    Assignee: Headway Technologies, Inc.
    Inventors: Yimin Guo, Kochan Ju, Po-Kang Wang, Cherng-Chyi Han, Hui-Chuan Wang
  • Patent number: 6129957
    Abstract: A method of manufacturing a magnetoresistive head comprises forming a magnetoresistive structure with a magnetoresistive element with a first AFM element. Perform a first annealing step at a high temperature with a high magnetic field. Form the remaining MR structure including second AFM elements. Perform a low magnetic field (H.sub.ann) annealing step following the fabrication of the second AFM elements. Then perform a no externally applied field (H.sub.ann =0) annealing step at a high temperature to increase the H.sub.ex of the second AFM element to full strength, whereby the stability of the first AFM element is enhanced or increases its H.sub.ex if there were a decrease during the low magnetic field annealing step.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: October 10, 2000
    Assignee: Headway Technologies, Inc.
    Inventors: Rongfu Xiao, Chyu-Jiuh Torng, Tai Min, Hui-Chuan Wang, Cherng-Chyi Han, Mao-Min Chen, Po-Kang Wan
  • Patent number: 6024886
    Abstract: Within a method for forming a magnetic transducer head there is first provided a substrate having formed thereover a lower magnetic pole layer in turn having formed thereupon a gap filling layer which is substantially planar. There is then formed upon the gap filling layer a patterned upper magnetic pole tip layer which serves as an etch mask layer for forming from the gap filling layer and the lower magnetic pole layer a patterned gap filling layer and an etched lower magnetic pole layer having a lower magnetic pole tip integral thereto, while simultaneously forming an etched patterned upper magnetic pole tip layer from the patterned upper magnetic pole tip layer. There is then formed upon the etched patterned upper magnetic pole tip layer and the etched lower magnetic pole layer a backfilling insulator layer to a thickness greater than a thickness of the etched patterned upper magnetic pole tip layer plus a thickness of the patterned gap filling layer plus a thickness of the lower magnetic pole tip.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: February 15, 2000
    Assignee: Headway Technologies, Inc.
    Inventors: Cherng-Chyi Han, Yongchang Feng, Rodney E. Lee, Hui-Chuan Wang