Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: A polyurethane resin and a method for manufacturing the same are provided. The method includes the following steps: mixing a polyester polyol, a polyether polyol, a first chain extender, diisocyanate, and a mixed solvent for polymerization, so as to obtain a prepolymer; and adding a second chain extender into the prepolymer for chain extension, so as to obtain the polyurethane resin. The mixed solvent includes diethylformamide and methyl ethyl ketone, and a mass ratio of the diethylformamide to the methyl ethyl ketone in the mixed solvent ranges from 0.45 to 1.80. Based on a total weight of the polyurethane resin being 100 wt %, a total added amount of the first chain extender and the second chain extender ranges from 0.9 wt % to 2.5 wt %.

Abstract: An aqueous acrylic resin with high heat resistance, a polymeric composition, and a method for preparing the aqueous acrylic resin with high heat resistance are provided. The polymeric composition includes a monomer composition and a reactive emulsifier. Based on 100 wt % of the monomer composition, the monomer composition includes at least one alkyl group containing methyl acrylate, at least one carboxyl group containing methacrylic acid, an alkene-based unsaturated group containing methyl acrylate, a hydroxyl group containing acrylic polyester polyol and/or a hydroxyl group containing acrylic polyether polyol, and an alkoxysilane.

Abstract: A water-based acrylic resin and a method for producing the same are provided. The water-based acrylic resin includes a polymerizable composition. The polymerizable composition includes deionized water, a reactive emulsifier, a first acrylic monomer, a second acrylic monomer, a third acrylic monomer, a fourth acrylic monomer, and an acrylic polyol. The reactive emulsifier is a nonylphenyl-free reactive emulsifier. The first acrylic monomer is an alkyl-containing (meth)acrylate. The second acrylic monomer is a hydroxyl-containing (meth)acrylate. The third acrylic monomer is a carboxyl-containing (meth)acrylate. The fourth acrylic monomer is an ethylenically-unsaturated-functional-groups-containing (meth)acrylate. The acrylic polyol is one or both of a hydroxyl-containing polyester acrylic polyol and a hydroxyl-containing polyether acrylic polyol.

Abstract: A polymeric composition, aqueous acrylic resin having high solvent resistance and a method for manufacturing the same, are provided. The polymeric composition includes an acrylic monomer polymer, an epoxy-containing silane and a reactive emulsifier. A weight ratio of the acrylic monomer polymer, the epoxy-containing silane and the reactive emulsifier is 100:1:3. The epoxy-containing silane is 1 to 3 wt % of (3-glycidoxypropyl) trimethoxy silane and/or 1 to 3 wt % of (3-glycidoxy propyl) methyl diethoxy silane.

Abstract: An aqueous acrylic resin with high heat resistance, a polymeric composition, and a method for preparing the aqueous acrylic resin with high heat resistance are provided. The polymeric composition includes a monomer composition and a reactive emulsifier. Based on 100 wt % of the monomer composition, the monomer composition includes at least one alkyl group containing methyl acrylate, at least one carboxyl group containing methacrylic acid, an alkene-based unsaturated group containing methyl acrylate, a hydroxyl group containing acrylic polyester polyol and/or a hydroxyl group containing acrylic polyether polyol, and an alkoxysilane.

Abstract: A low-VOC-emission waterborne coating is prepared from a waterborne acrylic emulsion, a hydrophilic cross-linking agent, a coalescing agent, additives and a pigment, and the waterborne acrylic emulsion is formed from performing emulsion polymerization on those reactive monomers including an alkyl-group-containing methyl acrylate, a hydroxyl-group-containing methyl acrylate, a carboxyl-group-containing methacrylic acid, a hydroxyl-group-containing acrylic polyester (polyether) polyol, and a methyl acrylate containing alkene-based unsaturated functional groups, which features high hardness, good adhesion, high luster, high acid resistance, high alkali resistance, good weatherability, high solvent resistance, high scrap resistance and high thermal shock resistance.

Abstract: A low-VOC-emission waterborne coating is prepared from a waterborne acrylic emulsion, a hydrophilic cross-linking agent, a coalescing agent, additives and a pigment, and the waterborne acrylic emulsion is formed from performing emulsion polymerization on those reactive monomers including an alkyl-group-containing methyl acrylate, a hydroxyl-group-containing methyl acrylate, a carboxyl-group-containing methacrylic acid, a hydroxyl-group-containing acrylic polyester (polyether) polyol, and a methyl acrylate containing alkene-based unsaturated functional groups, which features high hardness, good adhesion, high luster, high acid resistance, high alkali resistance, good weatherability, high solvent resistance, high scrap resistance and high thermal shock resistance.