Patents by Inventor Hui F Ip

Hui F Ip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical print resolution test die
    Patent number: 6649932
    Abstract: A test structure pattern includes a first comb, a second comb, and a serpentine line. The first comb includes a first set of tines of the same orientation. The second comb includes a second set of tines of the same orientation that are interdigitated with the first set of tines. The serpentine line runs between the interdigitated tines of the first metal comb and the second metal comb. The test structure pattern forms a first metal comb, a second metal comb, and a serpentine metal line on a die. Print quality and resolution is tested by checking for electrical continuity in the serpentine metal line and bridging between the serpentine metal line and one of the first metal comb and the second metal comb.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: November 18, 2003
    Assignee: Micrel, Inc.
    Inventors: Robert W. Rumsey, Hui F Ip, Arthur Lam