Patents by Inventor Hui-Fang Kao

Hui-Fang Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220173292
    Abstract: The present disclosure provides a semiconductor device.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 2, 2022
    Inventors: Ching-Hsing SHEN, Wen-Luh LIAO, Chen OU, Shih-Chang LEE, Hui-Fang KAO, Yun-Chung CHOU
  • Publication number: 20210305456
    Abstract: The present disclosure provides a semiconductor light-emitting device and a semiconductor light-emitting component. The semiconductor light-emitting device includes a substrate, a first semiconductor contact layer, a semiconductor light-emitting stack including an active layer, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure and a first electrode pad. The first-conductivity-type contact structure is electrically connected to the first semiconductor contact layer. The second-conductivity-type contact structure is electrically connected to the second semiconductor contact layer. The first-conductivity-type contact structure has a first bottom surface and a first top surface, and the active layer has a second bottom surface and a second top surface.
    Type: Application
    Filed: March 24, 2021
    Publication date: September 30, 2021
    Inventors: Jian-Zhi CHEN, Yen-Chun TSENG, Hui-Fang KAO, Yao-Ning CHAN, Yi-Tang LAI, Yun-Chung CHOU, Shih-Chang LEE, Chen OU
  • Patent number: 11121285
    Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: September 14, 2021
    Assignee: Epistar Corporation
    Inventors: Yung-Fu Chang, Hui-Fang Kao, Yi-Tang Lai, Shih-Chang Lee, Wen-Luh Liao, Mei Chun Liu, Yao-Ru Chang, Yi Hisao
  • Publication number: 20200152831
    Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Yung-Fu CHANG, Hui-Fang KAO, Yi-Tang LAI, Shih-Chang LEE, Wen-Luh LIAO, Mei Chun LIU, Yao-Ru CHANG, Yi HISAO
  • Patent number: D725051
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: March 24, 2015
    Assignee: Epistar Corporation
    Inventors: Hui-Fang Kao, Chih-Chiang Lu, Tzu-Chieh Hsu, Yi-Ming Chen
  • Patent number: D764421
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: August 23, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Tzu-Chieh Hsu, Yao-Ning Chan, Yi-Ming Chen
  • Patent number: D818974
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: May 29, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Tzu-Chieh Hsu, Yao-Ning Chan, Yi-Ming Chen
  • Patent number: D928104
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: August 17, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Hao-Chun Liang, Shih-Chang Lee
  • Patent number: D944218
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: February 22, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Hao-Chun Liang, Shih-Chang Lee
  • Patent number: D972769
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: December 13, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Hui-Fang Kao, Yao-Ning Chan, Yi-Tang Lai, Yun-Chung Chou, Shih-Chang Lee, Chen Ou