Abstract: A non-volatile memory cell includes a semiconductor substrate with isolation structures formed therein and thereby transistor region and capacitor region are defined therein. A conductor is disposed over the isolation structures, the transistor region and a first-type doped well disposed in the capacitor region. The conductor includes a capacitor portion disposed over the first-type doped well, a transistor portion disposed over the transistor region, a first edge disposed over the isolation structure at a side of the transistor region, and an opposite second edge disposed over the first-type doped well. Two first ion doped wells are disposed in the transistor region and respectively at two sides of the transistor portion, and constitutes a transistor with the transistor portion. A second ion doped region is disposed in the capacitor region excluding the conductor and constitutes a capacitor with the capacitor portion.

Abstract: A phase change memory device and a method of forming the same are provided. The phase change memory device includes a conducting electrode in a dielectric layer, a bottom electrode over the conducting electrode, a phase change layer over the bottom electrode, and a top electrode over the phase change layer. The phase change memory device may further include a heat sink layer between the phase change layer and the top electrode. The resistivities of the bottom electrode and the top electrode are preferably greater than the resistivity of the phase change material in the crystalline state.

Abstract: A non-volatile memory cell includes a semiconductor substrate with isolation structures formed therein and thereby transistor region and capacitor region are defined therein. A conductor is disposed over the isolation structures, the transistor region and a first-type doped well disposed in the capacitor region. The conductor includes a capacitor portion disposed over the first-type doped well, a transistor portion disposed over the transistor region, a first edge disposed over the isolation structure at a side of the transistor region, and an opposite second edge disposed over the first-type doped well. Two first ion doped wells are disposed in the transistor region and respectively at two sides of the transistor portion, and constitutes a transistor with the transistor portion. A second ion doped region is disposed in the capacitor region excluding the conductor and constitutes a capacitor with the capacitor portion.

Abstract: A phase change memory device and a method of forming the same are provided. The phase change memory device includes a conducting electrode in a dielectric layer, a bottom electrode over the conducting electrode, a phase change layer over the bottom electrode, and a top electrode over the phase change layer. The phase change memory device may further include a heat sink layer between the phase change layer and the top electrode. The resistivities of the bottom electrode and the top electrode are preferably greater than the resistivity of the phase change material in the crystalline state.

Abstract: A voltage supply control apparatus, suitable for being applied to a low voltage operation device. The voltage supply control apparatus has a high threshold voltage transistor and a low threshold voltage transistor. When the low voltage operation device is not working, the low threshold voltage transistor is cut off, and the voltage drop of a high voltage received from the power source terminal of the low voltage operation device is controlled by the high threshold voltage transistor. In contrast, when the low voltage operation device is working, the operation enable signal output thereby conducts the low threshold voltage transistor to control the voltage drop of the high voltage received from the power source terminal, so that a high potential is obtained.

Abstract: A voltage-reducing device of low power dissipation is provided, including a plurality of transistors, which are self-connected as diode equivalent. These transistors are then cascaded in series in the same direction and coupled to a voltage source. Since every transistor has a threshold voltage, the voltage at the end of the forward-biased cascaded transistors will be lowered than the voltage source so as to provide a reduced voltage source. Furthermore, since the voltage adjustment of the device is based on the threshold voltage, there is hardly any power dissipation. In addition, we can use different threshold voltages from various transistors to provide different combinations of these threshold voltages to obtain the desired voltage drop.

Abstract: A stream iron includes a support base, a handle, a reservoir portion which has an elbow-like water entry tube for preventing water stored inside the reservoir portion from spilling out when the steam iron is tilted forward, and an ironing plate having a bi-metallic plate. A related arrangement prevents water from flowing out of the ironing plate and getting clothes being ironed wet after the steam button has been pressed if the temperature of the ironing plate is lower than a certain minimum value.