Patents by Inventor Hui-Fen Wu

Hui-Fen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126861
    Abstract: A device unlocking method and an electronic device are provided. The method includes: detecting fingerprint information of a user by a first sensor of the electronic device; authenticating the fingerprint information and temporarily storing an authentication result of the fingerprint information; after authenticating the fingerprint information, detecting operation environment information related to the electronic device by a second sensor of the electronic device; and in response to the operation environment information meeting a default condition, unlocking the electronic device according to the authentication result.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 18, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chih-Hsien Yang, Hui-Fen Chen, I-Hsi Wu
  • Patent number: 5578528
    Abstract: A method for fabricating microelectromechanical systems containing a glass diaphragm formed on a silicon macrostructure is disclosed. The method comprises the steps of: (a) obtaining a silicon wafer and forming a cavity in the silicon wafer; (b) using a flame hydrolysis deposition technique to deposite glass soot into the cavity, the glass soot fills the cavity and extends onto the external surface of the silicon wafer so as to form a glass soot layer having a predetermined thickness; and (c) heat-consolidating the glass soot at temperatures between 850.degree. and 1,350.degree. C. so as to cause the glass soot to shrink and form a glass diaphragm over the cavity. The shrinkage ratio between the glass diaphragm and the glass soot layer is between 1:20 to 1:50. The silicon wafer can be further fabricated to contain a diaphragm-sealed cavity and/or a diaphragm-converted cantilever.
    Type: Grant
    Filed: May 2, 1995
    Date of Patent: November 26, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Dong-Sing Wuu, Tzung-Rue Hsieh, Hui-Fen Wu, Cuo-Lung Lei