Patents by Inventor HUI-FENG WEI

HUI-FENG WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080156057
    Abstract: A housing (10) used in portable electronic devices includes gripping portions (40) defined thereon, such gripping portions being bounded by grooving created in a surface of the housing. A method of manufacturing the housing is also provided, the method includes these steps: forming a housing; grinding the housing; polishing the housing; and forming the gripping portions on the housing.
    Type: Application
    Filed: May 24, 2007
    Publication date: July 3, 2008
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO.,LTD., SUTECH TRADING LIMITED
    Inventors: CHIH-PEN LIN, HUNG-CHANG LEE, YU-CHUAN CHEN, CHUANG LIU, HUI-FENG WEI, JIAN-PENG YU