Patents by Inventor Hui Gan

Hui Gan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130153190
    Abstract: A heat sink for dissipating heat of a heat-generating element on a circuit board includes a base, a linear fastener and a heat-dissipating fin set. The linear fastener includes a fixing section disposed on the base and an engaging section extending from the fixing section. The engaging section extends out of the base to be fixed on the circuit board. The heat-dissipation fin set is combined on the base and has stamped fins. The bottom of a portion of the stamped fins is provided with a receiving means at a position corresponding to the fixing section. The fixing section is disposed in the receiving means and clamped between the heat-dissipation fin set and the base. The linear fastener is used to combine the heat-dissipating fin set on the circuit board to increase the heat-dissipating efficiency of the heat sink to the heat-generating element.
    Type: Application
    Filed: January 11, 2012
    Publication date: June 20, 2013
    Inventor: Xue-Hui GAN
  • Publication number: 20130105112
    Abstract: A heat sink configured for heat dissipation of a heat-dissipating element on a circuit boards includes a base, a linear fastener and a heat-dissipating fin set. A surface of the base is provided with a groove. The linear fastener includes a fixing section and an engaging section bent to extend from the fixing section. The fixing section is disposed in the groove. The engaging section protrudes out of the base to be fixed onto the circuit board. The heat-dissipating fin set is constituted of a plurality of stamped fins engaged with each other. The heat-dissipating fin set is combined on the base to press the fixing section, thereby clamping the fixing section between the heat-dissipating fin set and the base. The linear fastener makes the heat-dissipating fin set to be combined on the circuit board, thereby increasing the heat-dissipating efficiency of the heat sink.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 2, 2013
    Inventor: Xue-Hui GAN
  • Publication number: 20070017834
    Abstract: A portable speaker assembly having a first driver coupled to a first portion of a telescoping enclosure and a second driver coupled to a second portion of the telescoping enclosure. The telescoping enclosure is movable between a first position and a second position and has an intermediate portion extending outwardly from the first portion and having a telescopically nesting engagement with a second portion. The intermediate portion is able to move telescopically relative to the second portion along a longitudinal axis of the enclosure. The second portion has at least one predetermined void adjacent to the telescopic connection of the intermediate portion with the second portion.
    Type: Application
    Filed: July 25, 2005
    Publication date: January 25, 2007
    Inventors: Thean Kuie Chang, Hui Gan, Aik Goh, Susimin Suprapmo
  • Patent number: D612967
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: March 30, 2010
    Assignee: Rovcal
    Inventors: Jun Hui Gan, Thomas Maskel