Patents by Inventor Hui Hong

Hui Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11352360
    Abstract: Disclosed are imidazole and thiazole compounds, as well as pharmaceutical compositions and methods of use thereof. One embodiment is a compound having the structure and pharmaceutically acceptable salts, prodrugs and N-oxides thereof (and solvates and hydrates thereof), wherein X, A, Z, R1 and R? are as described herein. In certain embodiments, a compound disclosed herein inhibits TGF-?, and can be used to treat disease by blocking TGF-? signaling.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: June 7, 2022
    Assignees: Rigel Pharmaceuticals, hic., Bristol-Myers Squibb Company
    Inventors: Todd Kinsella, Marina Gelman, Hui Hong, Ihab S. Darwish, Rajinder Singh, Jiaxin Yu, Robert M. Borzilleri, Upender Velaparthi, Peiying Liu, Chetan Padmakar Dame, Hasibur Rahaman, Jayakumar Sankara Warrier
  • Patent number: 11317001
    Abstract: Disclosed is an anti-counterfeiting printed material including: a background part for analyzing a distribution of Cyan Magenta Yellow Black (C/M/Y/K) after performing first color separation of an original image into C/M/Y/K, and printing the original image as C/M/Y/K lines each having an included angle preset according to each distribution; and a latent image part formed in a first region of the background part, and printed with the number of C/M/Y/K lines in a ratio different from the number of C/M/Y/K lines of the background part according to each distribution by performing secondary color separation, into C/M/Y/K, of a second region spaced apart from the first region by a preset distance.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 26, 2022
    Assignee: KOREA MINTING, SECURITY PRINTING ID CARD OPERATING CORP
    Inventors: Chang Jin Oh, Jong Gap Jeong, Gwang Hui Hong, Hui Seung Son, Hyeon Jun Kim
  • Patent number: 11213511
    Abstract: Disclosed is a pharmaceutical composition for preventing or treating severe acute respiratory syndrome coronavirus 2 infection disease, the composition comprising a compound represented by a Chemical Formula 1, or a pharmaceutically acceptable salt thereof, as an active ingredient.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 4, 2022
    Assignee: Syntekabio, Inc.
    Inventors: Jong Sun Jung, Jong Hui Hong, Dong Myung Kim, Bong Hwan Park, Young Bae Ryu, Hyung Jun Kwon, In Chul Lee, Ji Young Park
  • Publication number: 20210361619
    Abstract: Disclosed is a pharmaceutical composition for preventing or treating severe acute respiratory syndrome coronavirus 2 infection disease, the composition comprising a compound represented by a Chemical Formula 1, or a pharmaceutically acceptable salt thereof, as an active ingredient.
    Type: Application
    Filed: March 18, 2021
    Publication date: November 25, 2021
    Inventors: Jong Sun Jung, Jong Hui Hong, Dong Myung Kim, Bong Hwan Park, Young Bae Ryu, Hyung Jun Kwon, In Chul Lee, Ji Young Park
  • Publication number: 20210341179
    Abstract: The present disclosure provides a photovoltaic-photothermal reaction complementary full-spectrum solar utilization system, comprising: a waveband thermal reactor having a reactant flow channel and a reaction chamber therein, a photovoltaic cell attached to a surface of the waveband thermal reactor, and a full spectrum concentrator configured to concentrate full spectrum sunlight onto a surface of the photovoltaic cell, wherein the full spectrum concentrating device concentrates the full spectrum sunlight onto a upper surface of the opaque or transmissive photovoltaic cell, wherein a portion of the sunlight is converted into electric energy and another portion of the sunlight is converted into thermal energy, and wherein the thermal energy is utilized by the waveband thermal reactor to preheat reactant(s) in the reaction chamber and to make a portion of the reactant(s) to undergo an endothermic chemical reaction such that the thermal energy is stored as chemical energy.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Inventors: Hongguang JIN, Hui HONG, Yong HAO, Jie SUN, Yawen ZHAO, Wenjia LI, Qibin LIU
  • Patent number: 11139367
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a dielectric structure disposed over a substrate. A plurality of conductive interconnect layers are disposed within the dielectric structure. The plurality of conductive interconnect layers include alternating layers of interconnect wires and interconnect vias. A metal-insulating-metal (MIM) capacitor is arranged within the dielectric structure. The MIM capacitor has a lower conductive electrode separated from an upper conductive electrode by a capacitor dielectric structure. The MIM capacitor vertically extends past two or more of the plurality of conductive interconnect layers.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: October 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Jung-I Lin, Jhy-Jyi Sze, Alexander Kalnitsky, Yimin Huang, King Liao, Shen-Hui Hong
  • Patent number: 11092359
    Abstract: The present disclosure provides a photovoltaic-photothermal reaction complementary full-spectrum solar utilization system, comprising: a waveband thermal reactor having a reactant flow channel and a reaction chamber therein, a photovoltaic cell attached to a surface of the waveband thermal reactor, and a full spectrum concentrator configured to concentrate full spectrum sunlight onto a surface of the photovoltaic cell, wherein the full spectrum concentrating device concentrates the full spectrum sunlight onto a upper surface of the opaque or transmissive photovoltaic cell, wherein a portion of the sunlight is converted into electric energy and another portion of the sunlight is converted into thermal energy, and wherein the thermal energy is utilized by the waveband thermal reactor to preheat reactant(s) in the reaction chamber and to make a portion of the reactant(s) to undergo an endothermic chemical reaction such that the thermal energy is stored as chemical energy.
    Type: Grant
    Filed: February 6, 2016
    Date of Patent: August 17, 2021
    Assignee: Institute of Engineering Thermophysics, Chinese Academy of Sciences
    Inventors: Hongguang Jin, Hui Hong, Yong Hao, Jie Sun, Yawen Zhao, Wenjia Li, Qibin Liu
  • Publication number: 20210168260
    Abstract: Disclosed is an anti-counterfeiting printed material including: a background part for analyzing a distribution of Cyan Magenta Yellow Black (C/M/Y/K) after performing first color separation of an original image into C/M/Y/K, and printing the original image as C/M/Y/K lines each having an included angle preset according to each distribution; and a latent image part formed in a first region of the background part, and printed with the number of C/M/Y/K lines in a ratio different from the number of C/M/Y/K lines of the background part according to each distribution by performing secondary color separation, into C/M/Y/K, of a second region spaced apart from the first region by a preset distance.
    Type: Application
    Filed: September 19, 2019
    Publication date: June 3, 2021
    Applicant: KOREA MINTING, SECURITY PRINTING ID CARD OPERATING CORP
    Inventors: Chang Jin OH, Jong Gap JEONG, Gwang Hui HONG, Hui Seung SON, Hyeon Jun KIM
  • Patent number: 10861894
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of photodiodes is formed from a front-side of a substrate. A plurality of boundary deep trench isolation (BDTI) trenches having a first depth and a plurality of multiple deep trench isolation (MDTI) trenches having a second depth are formed from a back-side of the substrate. A stack of dielectric layers is formed in the BDTI trenches and the MDTI trenches. A plurality of color filters is formed overlying the stack of dielectric layers corresponding to the plurality of photodiodes.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: December 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Publication number: 20200343281
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a plurality of pixel regions disposed within a substrate and respectively comprising a photodiode configured to receive radiation that enters the substrate from a back-side. A boundary deep trench isolation (BDTI) structure is disposed at boundary regions of the pixel regions surrounding the photodiode. The BDTI structure extends from the back-side of the substrate to a first depth within the substrate. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel regions overlying the photodiode. The MDTI structure extends from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure is a continuous integral unit having a ring shape.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Patent number: 10727265
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within a substrate and respectively comprising a photodiode. The photodiode comprises a doped layer with a first doping type and an adjoining region of the substrate with a second doping type that is different than the first doping type. A boundary deep trench isolation (BDTI) structure is disposed between adjacent pixel regions. A multiple deep trench isolation (MDTI) structure overlies the doped layer of the photodiode. The MDTI structure comprises a stack of dielectric layers lining sidewalls of a MDTI trench. A plurality of color filters is disposed at the back-side of the substrate corresponding to the respective photodiode of the plurality of pixel regions and overlying the MDTI structure.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: July 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Publication number: 20200135844
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a dielectric structure disposed over a substrate. A plurality of conductive interconnect layers are disposed within the dielectric structure. The plurality of conductive interconnect layers include alternating layers of interconnect wires and interconnect vias. A metal-insulating-metal (MIM) capacitor is arranged within the dielectric structure. The MIM capacitor has a lower conductive electrode separated from an upper conductive electrode by a capacitor dielectric structure. The MIM capacitor vertically extends past two or more of the plurality of conductive interconnect layers.
    Type: Application
    Filed: March 27, 2019
    Publication date: April 30, 2020
    Inventors: Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Jung-I Lin, Jhy-Jyi Sze, Alexander Kalnitsky, Yimin Huang, King Liao, Shen-Hui Hong
  • Publication number: 20200058686
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of photodiodes is formed from a front-side of a substrate. A plurality of boundary deep trench isolation (BDTI) trenches having a first depth and a plurality of multiple deep trench isolation (MDTI) trenches having a second depth are formed from a back-side of the substrate. A stack of dielectric layers is formed in the BDTI trenches and the MDTI trenches. A plurality of color filters is formed overlying the stack of dielectric layers corresponding to the plurality of photodiodes.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Publication number: 20200058685
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within a substrate and respectively comprising a photodiode. The photodiode comprises a doped layer with a first doping type and an adjoining region of the substrate with a second doping type that is different than the first doping type. A boundary deep trench isolation (BDTI) structure is disposed between adjacent pixel regions. A multiple deep trench isolation (MDTI) structure overlies the doped layer of the photodiode. The MDTI structure comprises a stack of dielectric layers lining sidewalls of a MDTI trench. A plurality of color filters is disposed at the back-side of the substrate corresponding to the respective photodiode of the plurality of pixel regions and overlying the MDTI structure.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Publication number: 20200031832
    Abstract: Disclosed are imidazole and thiazole compounds, as well as pharmaceutical compositions and methods of use thereof. One embodiment is a compound having the structure and pharmaceutically acceptable salts, prodrugs and N-oxides thereof (and solvates and hydrates thereof), wherein X, A, Z, R1 and R? are as described herein. In certain embodiments, a compound disclosed herein inhibits TGF-?, and can be used to treat disease by blocking TGF-? signaling.
    Type: Application
    Filed: March 21, 2019
    Publication date: January 30, 2020
    Inventors: Todd Kinsella, Marina Gelman, Hui Hong, Ihab S. Darwish, Rajinder Singh, Jiaxin Yu, Robert M. Borzilleri, Upender Velaparthi, Peiying Liu, Chetan Padmakar Darne, Hasibur Rahaman, Jayakumar Sankara Warrier
  • Patent number: 10461109
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within a substrate and respectively comprising a photodiode. A boundary deep trench isolation (BDTI) structure is disposed between adjacent pixel regions, extending from a back-side of the substrate to a first depth within the substrate, and surrounding the photodiode. A multiple deep trench isolation (MDTI) structure is disposed within the individual pixel region, extending from the back-side of the substrate to a second depth within the substrate, and overlying the photodiode. A dielectric layer fills in a BDTI trench of the BDTI structure and a MDTI trench of the MDTI structure.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Publication number: 20190165009
    Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within a substrate and respectively comprising a photodiode. A boundary deep trench isolation (BDTI) structure is disposed between adjacent pixel regions, extending from a back-side of the substrate to a first depth within the substrate, and surrounding the photodiode. A multiple deep trench isolation (MDTI) structure is disposed within the individual pixel region, extending from the back-side of the substrate to a second depth within the substrate, and overlying the photodiode. A dielectric layer fills in a BDTI trench of the BDTI structure and a MDTI trench of the MDTI structure.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 30, 2019
    Inventors: Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang, Chun-Yuan Chen, Shen-Hui Hong
  • Patent number: 10287295
    Abstract: Disclosed are imidazole and thiazole compounds, as well as pharmaceutical compositions and methods of use thereof. One embodiment is a compound having the structure and pharmaceutically acceptable salts, prodrugs and N-oxides thereof (and solvates and hydrates thereof), wherein X, A, Z, R1 and R? are as described herein. In certain embodiments, a compound disclosed herein inhibits TGF-?, and can be used to treat disease by blocking TGF-? signaling.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: May 14, 2019
    Assignees: Rigel Pharmaceuticals, Inc., Bristol-Meyers Squibb Company
    Inventors: Todd Kinsella, Marina Gelman, Hui Hong, Ihab S. Darwish, Rajinder Singh, Jiaxin Yu, Robert M. Borzilleri, Upender Velaparthi, Peiying Liu, Chetan Padmakar Darne, Hasibur Rahaman, Jayakumar Sankara Warrier
  • Patent number: D882292
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: April 28, 2020
    Assignee: Bathroom Servant Corporation
    Inventors: Cheng-Cheng Ma, Teng-Hui Hong
  • Patent number: D886683
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: June 9, 2020
    Assignee: Shenzhen Heibaihong Electronic Commerce Co., Ltd.
    Inventor: Teng-Hui Hong