Patents by Inventor Hui-Hsiu Tang

Hui-Hsiu Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7838065
    Abstract: Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: November 23, 2010
    Assignee: National Tsing Hua University
    Inventors: Tzu-Chien Wei, Chi-Chao Wan, Yeng-Yun Wang, Hui-Hsiu Tang
  • Publication number: 20080063788
    Abstract: Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.
    Type: Application
    Filed: March 8, 2007
    Publication date: March 13, 2008
    Applicant: Tzu-Chien WEI
    Inventors: Tzu-Chien Wei, Chi-Chao Wan, Yeng-Yun Wang, Hui-Hsiu Tang