Patents by Inventor Hui-Hsuan Chuang

Hui-Hsuan Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8295050
    Abstract: A dual CPU and its heat dissipating structure are applied to a heat dissipating module installed on a dual-CPU computer device, and CPUs are arranged alternately with each other on a motherboard, and the heat dissipating modules are installed at positions of the CPUs, such that the alternately arranged heat dissipating modules can prevent interferences by external cold air, and a heat source produced by the CPUs can be conducted and dissipated to the outside to prevent the heat source form remaining at the surrounding of the CPUs and related components installed on the motherboard to achieve an excellent heat dissipating efficiency.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: October 23, 2012
    Assignee: Portwell Inc.
    Inventors: Hui-Hsuan Chuang, Chia-Ming Cheng
  • Publication number: 20120113587
    Abstract: A dual CPU and its heat dissipating structure are applied to a heat dissipating module installed on a dual-CPU computer device, and CPUs are arranged alternately with each other on a motherboard, and the heat dissipating modules are installed at positions of the CPUs, such that the alternately arranged heat dissipating modules can prevent interferences by external cold air, and a heat source produced by the CPUs can be conducted and dissipated to the outside to prevent the heat source form remaining at the surrounding of the CPUs and related components installed on the motherboard to achieve an excellent heat dissipating efficiency.
    Type: Application
    Filed: November 5, 2010
    Publication date: May 10, 2012
    Inventors: Hui-Hsuan CHUANG, Chia-Ming Cheng