Patents by Inventor Hui-Hung Chen
Hui-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152187Abstract: A foldable electronic device including a first body, a second body, a hinge module, and a cover is provided. The hinge module is connected to the first body and the second body, such that the first body and the second body are rotated relatively to be folded or unfolded via the hinge module. The hinge module has a protruding rod eccentric to a rotation center of the hinge module. The cover is pivoted to the second body and located on a moving path of the protruding rod. The hinge module drives the cover to be rotated relative to the second body via the protruding rod.Type: ApplicationFiled: October 24, 2023Publication date: May 9, 2024Applicant: Acer IncorporatedInventors: Chun-Hung Wen, Chun-Hsien Chen, Hui-Ping Sun, Wen-Neng Liao, Yu-Ming Lin, Kuan-Lin Chen
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Publication number: 20240126327Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
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Patent number: 11960153Abstract: A folding lens system includes: a polarization-dependence device, a first optical device, a first polarization controller, a second optical device and a second polarization controller. The polarization-dependence device has a first surface and a second surface opposite to the first surface. The first optical device is located at a side facing toward the first surface of the polarization-dependence device. The first polarization controller is located between the polarization-dependence device and the first optical device. The first polarization controller has the same curvature as the first surface of the polarization-dependence device. The second optical device is located at a side facing toward the second surface of the polarization-dependence device. The second polarization controller is located between the polarization-dependence device and the second optical device. The second polarization controller has the same curvature as the second surface of the polarization-dependence device.Type: GrantFiled: November 3, 2022Date of Patent: April 16, 2024Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution LimitedInventors: Po Lun Chen, Yun Pei Chen, Hui-Ping Shen, Ting-Huei Chen, Wei-Hung Tsay
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Patent number: 11953942Abstract: A foldable electronic device having multiple screens is provided. The foldable electronic device includes a first screen, a worm rod, a moving member, at least one second screen, and at least one linking rod. The worm rod is rotatably disposed on the first screen. The moving member is coupled to the worm rod to move along the worm rod when the worm rod rotates. The second screen is movably disposed on the first screen. The linking rod is pivotally connected between the moving member and the second screen. When the moving part moves along the worm rod, the second screen is driven to move away from or closed to the worm rod by the linking rod, so that the second screen moves out of the first screen or is accommodated behind the first screen.Type: GrantFiled: February 18, 2021Date of Patent: April 9, 2024Assignee: Acer IncorporatedInventors: Hui-Ping Sun, Yen-Chou Chueh, Chun-Hung Wen, Chun-Hsien Chen
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Publication number: 20240111330Abstract: A foldable electronic device is provided, including a first body, a second body, a supporting member, a first hinge connecting the first body and the supporting member, a second hinge connecting the supporting member and the second body, and a gravity-type latch movably disposed in the supporting member. The first body and the supporting member are rotated relatively to be folded or unfolded via the first hinge, and the second body and the supporting member are rotated relatively to be folded or unfolded via the second hinge. In a transforming process of the first body folding to the supporting member and together unfolding relative to the second body, the gravity-type latch is latched onto the first body once the unfolding angle is less than a predetermined value, and the gravity-type latch is de-latched from the first body once the unfolding angle is equal to or greater than the predetermined value.Type: ApplicationFiled: May 4, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Jui-Yi Yu, Chun-Hsien Chen, Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh
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Publication number: 20240111339Abstract: A cabling structure of a foldable electronic device includes a first body, a second body, a hinge module connecting the first body and the second body, a sliding member movably disposed in the second body, a flexible electrical connecting member connected to the first body, the second body, and the sliding member and being driven when the first body and the second body are rotated relatively, and a restoring module disposed in the second body and providing a force to the sliding member. The first body and the second body are rotated relatively to each other through the hinge module. When being rotated relatively to each other, the first body and the second body drive the flexible electrical connecting member and the sliding member. The restoring module restores the sliding member and the flexible electrical connecting member via the force.Type: ApplicationFiled: May 8, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
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Publication number: 20240098932Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.Type: ApplicationFiled: July 19, 2023Publication date: March 21, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Yu-Ming Lin, Chun-Hsien Chen
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Patent number: 11934223Abstract: A foldable electronic device, including a first body having a first shaft member, at least one second body having a second shaft member, and a latching member, is provided. The first shaft member and the second shaft member are coaxially pivoted together. The first shaft member has a recess. The second shaft member has a locking hole. The latching member is movably disposed in the recess and the locking hole, so that when the latching member leaves the locking hole, the first body and the second body are relatively pivoted through the first shaft member and the second shaft member, or when the latching member moves into the locking hole, the latching member interferes with the first shaft member and the second shaft member to block the first body and the second body from relatively pivoting.Type: GrantFiled: May 30, 2022Date of Patent: March 19, 2024Assignee: Acer IncorporatedInventors: Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
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Publication number: 20240069618Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.Type: ApplicationFiled: April 27, 2023Publication date: February 29, 2024Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
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Patent number: 7402510Abstract: A method for forming bumps is disclosed. First, a substrate having an adhesive, a barrier, and a wetting layer thereon is provided. Next, a patterned photoresist is formed on the wetting layer, in which the patterned photoresist includes at least one opening for exposing a portion of the wetting layer. Next, a solder is deposited in the opening, and a stripping process is performed to remove the patterned photoresist. Next, a first etchant is utilized to perform a first etching process for etching a portion of the wetting and barrier layers by utilizing the solder as a mask, in which the first etchant is selected from the group consisting of: sulfuric acid, phosphoric acid, ferric chloride, ammonium persulfate, and potassium monopersulfate. Next, a second etchant is utilized to perform a second etching process removing a portion of the adhesive layer, and a reflow process is performed to form a bump.Type: GrantFiled: August 7, 2006Date of Patent: July 22, 2008Assignee: Advanced Semiconductor Engineering, Inc.Inventors: En-Chieh Wu, Hiew Watt Ng, Hui-Hung Chen, Chi-Long Tsai
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Publication number: 20070087546Abstract: A method for forming bumps is disclosed. First, a substrate having an adhesive, a barrier, and a wetting layer thereon is provided. Next, a patterned photoresist is formed on the wetting layer, in which the patterned photoresist includes at least one opening for exposing a portion of the wetting layer. Next, a solder is deposited in the opening, and a stripping process is performed to remove the patterned photoresist. Next, a first etchant is utilized to perform a first etching process for etching a portion of the wetting and barrier layers by utilizing the solder as a mask, in which the first etchant is selected from the group consisting of: sulfuric acid, phosphoric acid, ferric chloride, ammonium persulfate, and potassium monopersulfate. Next, a second etchant is utilized to perform a second etching process removing a portion of the adhesive layer, and a reflow process is performed to form a bump.Type: ApplicationFiled: August 7, 2006Publication date: April 19, 2007Inventors: En-Chieh Wu, Hiew Watt NG, Hui-Hung Chen, Chi-Long Tsai
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Patent number: D1024051Type: GrantFiled: August 10, 2021Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Hui-Jung Huang, Hong-Kuan Li, I-Lun Li, Ling-Mei Kuo, Kuan-Ju Chen, Fang-Ying Huang, Kai-Hung Huang, Szu-Wei Yang, Kai-Teng Cheng