Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Abstract: A key structure includes a base, a bracket, a sensing circuit, an elastic member, a key cap, and a screwing member. The bracket is disposed on the base, the sensing circuit is disposed on the bracket, and the sensing circuit has an opening. The elastic member is disposed on the sensing circuit and covers the opening. The key cap is disposed on the elastic member. The screwing member passes through the opening and screws the bracket to the base, and the key cap, the elastic member, and the screwing member are coaxially arranged. In addition, a portable computer.

Abstract: A body structure of a portable computer including a case, a keyboard module, a touch pad module, and a cover. The case has an inner surface and an exterior surface opposite to each other, and the exterior surface is exposed to an outer environment. The case further has a first receiving opening, a second receiving opening, and a rib structure separating the first and the second receiving openings. The keyboard module is assembled to the second receiving opening from the exterior surface and locked at the rib structure. The touch pad module is assembled to the first receiving opening from the exterior surface and locked at the rib structure. The cover is assembled to the case and covers the rib structure.

Abstract: A foldable electronic device is provided, including a first body, a second body, a supporting member, a first hinge connecting the first body and the supporting member, a second hinge connecting the supporting member and the second body, and a gravity-type latch movably disposed in the supporting member. The first body and the supporting member are rotated relatively to be folded or unfolded via the first hinge, and the second body and the supporting member are rotated relatively to be folded or unfolded via the second hinge. In a transforming process of the first body folding to the supporting member and together unfolding relative to the second body, the gravity-type latch is latched onto the first body once the unfolding angle is less than a predetermined value, and the gravity-type latch is de-latched from the first body once the unfolding angle is equal to or greater than the predetermined value.

Abstract: A cabling structure of a foldable electronic device includes a first body, a second body, a hinge module connecting the first body and the second body, a sliding member movably disposed in the second body, a flexible electrical connecting member connected to the first body, the second body, and the sliding member and being driven when the first body and the second body are rotated relatively, and a restoring module disposed in the second body and providing a force to the sliding member. The first body and the second body are rotated relatively to each other through the hinge module. When being rotated relatively to each other, the first body and the second body drive the flexible electrical connecting member and the sliding member. The restoring module restores the sliding member and the flexible electrical connecting member via the force.

Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A space position device capable of generating position signals according to its position in space is used in the camera control system for tracking an object. The space position device generates and transmits its position signals to a control unit every predetermined time interval. The control unit then generates control command for controlling a camera to rotate upward/downward, leftward/rightward, zoom in or zoom out according to the generated position signals such that the camera adjusts its focus on the space position device for tracking an object automatically.

Abstract: The synchronous briefing or visual playback in different areas and capability of receiving multiple image sources are achieved by connecting various briefing subsystems in different areas via the Internet. One or more image sources are configured in each briefing subsystem and each connected to a server of the subsystem via physical or wireless network. The server of each briefing subsystem transmits briefing or image data to a playback device for outputting purpose via physical or wireless network. The internet-connected servers in all the briefing subsystems are capable of transmitting briefing or image data to one another via the Internet such that briefing or image outputting in one subsystem can be synchronously performed in other subsystems.