Abstract: A display substrate includes: a first substrate, a second substrate, a liquid crystal layer, a plurality of pixel electrodes, and a plurality of light-emitting elements. The plurality of pixel electrodes and the plurality of light-emitting elements are both disposed on a side, proximal to the liquid crystal layer, of the first substrate.

Abstract: The present disclosure discloses a display substrate, a control method thereof and a display device, and relates to the field of display technologies. The display substrate includes: a first substrate, a second substrate, a liquid crystal layer, a plurality of pixel electrodes, and a plurality of light-emitting elements. The plurality of pixel electrodes and the plurality of light-emitting elements are both disposed on a side, proximal to the liquid crystal layer, of the first substrate. When external ambient light is weak, the plurality of light-emitting elements in the display substrate may supply auxiliary light sources to the display substrate, such that the display substrate normally emits light to ensure a display effect.

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.

Abstract: An automatic door device includes a driving motor and a transmission system. An input end of the transmission system is coupled to an output shaft of the driving motor, an output end of the transmission system is coupled to a door shaft, and the transmission system has a transmission link to transmit an output torque of the driving motor to the door shaft. A clutch mechanism is disposed on the transmission link of the transmission system. Accordingly, when the door is subjected to an external force, the transmission link between the door and the driving motor can be automatically disconnected, so that while an automatic door function implemented, it is ensured that a user may not be affected by the resistance brought by the automatic door device when the user opens/closes the door manually, thereby optimizing user experience.

Abstract: This application provides a package body, including: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components, the low frequency shielding conductive structure is provided with a plurality of through holes, an area of an opening of each of at least some through holes is less than 1 mm*1 mm, and a thickness of the low frequency shielding conductive structure is not less than 10 ?m. This application further provides a terminal and an electronic device to which the package body is applied and a preparation method of the package body.

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Abstract: A magnetic probe-based current measurement device and measurement method is disclosed. The device comprises a conductor for a current under test, a magnetic probe, a magnetic bias structure, and a programmable chip. A conductor has a first axis, a second axis, and a third axis. The conductor is provided with through holes. The direction of the through holes are parallel to the third axis. Vertical projections of the through holes on a first cross section are symmetric about the first axis. At least one of the through holes has a center position located on the first axis. And/or every pair of the through holes have center positions that are symmetric about the first axis. The magnetic probe is provided within the through holes, and is electrically connected to the programmable chip. A sensitive center position of the magnetic probe is located on the first cross section. A vertical projection of the magnetic probe on the first cross section is symmetric about the first axis.

Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.

Abstract: The present disclosure relates to the field of LED display technologies, and provides an LED chip, an LED light emitting substrate, a display device and a control method thereof. Specifically, the LED chip comprises: an N-type semiconductor layer, a P-type semiconductor layer, as well as a quantum well layer between the N-type semiconductor layer and the P-type semiconductor layer. The quantum well layer is made of indium gallium nitride, wherein indium atoms have a molar ratio of greater than or equal to 0.3 in the indium gallium nitride.

Abstract: A backlight source is provided which includes a light guide plate 10 and a light-emitting unit 20. The light guide plate 10 includes a first surface and a second surface disposed oppositely. The light-emitting unit 20 is located on the side of the light guide plate where the first surface disposed. The grating layer 30 includes at least one grating unit configured to diffract light emitted by the light-emitting unit 20. The overall structure of the backlight source is no longer limited by the distance between the LEDs and the first layer diffusion layer, and therefore the thinning and lightening of the backlight source is realized. A manufacturing method of a backlight source and a display device are further provided.

Abstract: A pixel unit circuit includes a light emitting element, a first end thereof being coupled to a low level input end; a storage capacitor module, a first end thereof being coupled to a direct current voltage input end; a driving transistor, a gate electrode thereof being coupled to a second end of the storage capacitor module, and a first electrode thereof being coupled to a second end of the light emitting element; a first control module, coupled to a gate line, a data line and the gate electrode of the driving transistor, configured to control whether the gate electrode of the driving transistor is connected to the data line under the control of the gate line; and a potential control transistor, a gate electrode and a first electrode thereof being coupled to the first electrode of the driving transistor, the second electrode thereof being grounded.

Abstract: The present disclosure provides a pixel circuit and a drive method thereof, and a touch display apparatus. The pixel circuit includes a pixel driving circuit, an optical sensing circuit, and a light-emitting element. The pixel driving circuit is configured to drive the light-emitting element to emit light, based on a first control signal from a first control line, a second control signal from a second control line, a scanning signal from a scanning line, and a data signal from a data line. The optical sensing circuit is configured to sense an optical signal, convert the sensed optical signal into an electric signal, and output the electric signal via a reading line based on the first control signal, the second control signal, the scanning signal, and the data signal.

Abstract: An automatic door device includes a driving motor and a transmission system. An input end of the transmission system is coupled to an output shaft of the driving motor, an output end of the transmission system is coupled to a door shaft, and the transmission system has a transmission link to transmit an output torque of the driving motor to the door shaft. A clutch mechanism is disposed on the transmission link of the transmission system. Accordingly, when the door is subjected to an external force, the transmission link between the door and the driving motor can be automatically disconnected, so that while an automatic door function implemented, it is ensured that a user may not be affected by the resistance brought by the automatic door device when the user opens/closes the door manually, thereby optimizing user experience.

Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.

Abstract: A light guide plate, a backlight module and a display device are provided. A plurality of blind holes is arranged at a surface of the light guide plate; the blind hole is filled with a light-converting unit; the light-converting unit includes an accommodating cavity made of a light-transmitting material, and a light-converting material located in the accommodating cavity; and a gap is between an outer wall of the accommodating cavity and an inner wall of the blind hole.

Abstract: Disclosed are an array substrate, and a display device, and a method for manufacturing the same. The array substrate includes: a base substrate, and a thin film transistor, a planarization pattern, a bonding pattern, and a conductive structure that are disposed on the base substrate. The thin film transistor, the planarization pattern, and the bonding pattern are laminated in a direction going distally from the base substrate. The planarization pattern is provided with a via and a groove, the conductive structure is disposed in the via, wherein the bonding pattern is conductive and is electrically connected to the thin film transistor by the conductive structure, an orthographic projection of the bonding pattern on the base substrate falls outside an orthographic projection of the groove on the base substrate, and the groove is configured to accommodate an adhesive.

Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.