Patents by Inventor Huijuan Wang

Huijuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133975
    Abstract: A computerized simulation validating method for a full-scale distribution network single phase-to-ground fault test is implemented by simulating a full-scale test system with external quantities being controlled to be conformant and validating the full-scale distribution network single phase-to-ground fault test based on a conformance check result between the internal quantities of the field testing and the internal quantities of the simulation testing. The simulation validating method for a full-scale distribution network single phase-to-ground fault test improves normalization and conformance of the full-scale distribution network ground fault test. The computerized simulation validating system, apparatus, and medium for a full-scale distribution network single phase-to-ground fault test also achieve the benefits noted above.
    Type: Application
    Filed: August 10, 2023
    Publication date: April 25, 2024
    Inventors: Zhi LI, Shaofeng YU, Dingfang KE, Peibo WANG, Kan SUN, Weiqiang LANG, Haijiang XU, Kelong WANG, Zhiyong LI, Kun YU, Guangyao YING, Xuqiang HE, Yezhao CHEN, Xiang ZHANG, Mingxiao DU, Huijuan GUI, Hongling HU, Biao PENG, Xubin XIAO
  • Patent number: 11963429
    Abstract: A display module (10) includes: a display panel (12) and a circuit board (14) coupled to the display panel (12). The display panel (12) includes a driving chip (122) and a display unit (124); and the circuit board (14) includes a first filter element (142), wherein the first filter element (142) is coupled to the driving chip (122) and the display unit (124), and a direct current signal output by the driving chip (122) is filtered by the first filter element (142) and then transmitted to the display unit (124). The present disclosure also provides a display apparatus (100).
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: April 16, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yu Wang, Yi Zhang, Tingliang Liu, Tinghua Shang, Huijuan Yang, Yang Zhou, Pengfei Yu, Linhong Han, Hao Zhang, Xiaofeng Jiang, Huijun Li
  • Patent number: 11957033
    Abstract: Provided are a display panel, a manufacturing method thereof, and a display device. The display panel includes an alignment mark region arranged within a flat region of a peripheral region of the display panel. The peripheral region is a region of the display panel other than an active area of the display panel. An alignment mark pattern is arranged within the alignment mark region, and/or at least one film layer within the alignment mark region is hollowed out.
    Type: Grant
    Filed: May 9, 2020
    Date of Patent: April 9, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Huijuan Yang, Tingliang Liu, Tinghua Shang, Yang Zhou, Pengfei Yu, Yi Zhang, Junxi Wang
  • Patent number: 11951104
    Abstract: The present invention provides an aripiprazole sustained-release microsphere and a preparation method therefor. The microsphere comprises aripiprazole and polylactide-glycolide. The microsphere is of a spherical reticular skeleton structure, with reticular micropores distributed in the spherical surface, and aripiprazole filled in the micropores. The average particle diameter of the microsphere is less than 20 ?m, and is suitable for a 5 gauge needle. The content of aripiprazole is 65%-80% of the total weight of the microsphere.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: April 9, 2024
    Assignee: ZHUHAI LIVZON MICROSPHERE TECHNOLOGY CO. LTD.
    Inventors: Bin Chen, Xia Yin, Yanqing Wang, Peng Xu, Yuda Yang, Miaoli Chen, Weilun Ye, Linyan Lv, Huijuan Xu, Wenqi Lu, Xiangsheng Kong, Xiaoman Jiang
  • Publication number: 20240111185
    Abstract: The present disclosure discloses a display substrate, a control method thereof and a display device, and relates to the field of display technologies. The display substrate includes: a first substrate, a second substrate, a liquid crystal layer, a plurality of pixel electrodes, and a plurality of light-emitting elements. The plurality of pixel electrodes and the plurality of light-emitting elements are both disposed on a side, proximal to the liquid crystal layer, of the first substrate. When external ambient light is weak, the plurality of light-emitting elements in the display substrate may supply auxiliary light sources to the display substrate, such that the display substrate normally emits light to ensure a display effect.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 4, 2024
    Inventors: Huijuan WANG, Xue DONG, Wanxian XU, Zhenhua LV
  • Patent number: 11929358
    Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: March 12, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhiwei Liang, Wenqian Luo, Yingwei Liu, Ke Wang, Qi Yao, Huijuan Wang, Haixu Li, Zhanfeng Cao, Guangcai Yuan, Xue Dong, Guoqiang Wang, Zhijun Lv
  • Publication number: 20240081103
    Abstract: A display substrate and a display device are disclosed. In the display substrate, a plurality of openings include a plurality of opening groups, the plurality of opening groups include a plurality of opening group rows, each of the opening groups includes a first opening and a second opening, the plurality of opening group rows includes a first opening group row and a second opening group row, the spacer is located between the first opening of the first opening group row and the second opening of the second opening group row, an orthographic projection of the first opening includes a first long edge, and an orthographic projection of the second opening includes a second long edge, the first long edge is parallel to the second long edge, an extension line of the first long edge is misaligned from an extension line of the second long edge.
    Type: Application
    Filed: October 11, 2023
    Publication date: March 7, 2024
    Inventors: Hao ZHANG, Tingliang LIU, Yu WANG, Huijun LI, Huijuan YANG, Xiaofeng JIANG, Xin ZHANG, Jie DAI, Lu BAI, Pengfei YU, Tinghua SHANG
  • Patent number: 11922838
    Abstract: A display panel, comprising a first insulating structural layer, a first crack detection line, a second insulating structural layer and a second crack detection line which are sequentially arranged on a substrate, wherein the first crack detection line and the second crack detection line are both located in a peripheral area and are arranged around a display area, one end of the first crack detection line is configured to receive a detection signal, and the other end of the first crack detection line is configured to output a first output signal, and one end of the second crack detection line is configured to receive a detection signal and the other end of the second crack detection line is configured to output a second output signal.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: March 5, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yu Wang, Yi Zhang, Tingliang Liu, Chang Luo, Hao Zhang, Huijuan Yang, Tinghua Shang, Yang Zhou, Pengfei Yu, Shun Zhang, Xiaofeng Jiang, Huijun Li, Linhong Han
  • Patent number: 11917750
    Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.
    Type: Grant
    Filed: February 17, 2020
    Date of Patent: February 27, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huijuan Wang, Jinsen Cai, Bin Hu, Bo Kong, Tian Zhao
  • Patent number: 11859428
    Abstract: An automatic door device includes a driving motor and a transmission system. An input end of the transmission system is coupled to an output shaft of the driving motor, an output end of the transmission system is coupled to a door shaft, and the transmission system has a transmission link to transmit an output torque of the driving motor to the door shaft. A clutch mechanism is disposed on the transmission link of the transmission system. Accordingly, when the door is subjected to an external force, the transmission link between the door and the driving motor can be automatically disconnected, so that while an automatic door function implemented, it is ensured that a user may not be affected by the resistance brought by the automatic door device when the user opens/closes the door manually, thereby optimizing user experience.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: January 2, 2024
    Assignee: BSH Hausgeraete GmbH
    Inventors: Guojie Li, Jun Chen, Huijuan Wang, Tao Sun, Xiuwei Wu
  • Publication number: 20230309281
    Abstract: This application provides a package body, including: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components, the low frequency shielding conductive structure is provided with a plurality of through holes, an area of an opening of each of at least some through holes is less than 1 mm*1 mm, and a thickness of the low frequency shielding conductive structure is not less than 10 ?m. This application further provides a terminal and an electronic device to which the package body is applied and a preparation method of the package body.
    Type: Application
    Filed: September 24, 2021
    Publication date: September 28, 2023
    Inventors: Le Zhang, Xueping Guo, Huijuan Wang
  • Publication number: 20230260982
    Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
    Type: Application
    Filed: April 21, 2023
    Publication date: August 17, 2023
    Inventors: Zhiwei Liang, Wenqian Luo, Yingwei Liu, Ke Wang, Qi Yao, Huijuan Wang, Haixu Li, Zhanfeng Cao, Guangcai Yuan, Xue Dong, Guoqiang Wang, Zhijun Lv
  • Patent number: 11688724
    Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: June 27, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhiwei Liang, Wenqian Luo, Yingwei Liu, Ke Wang, Qi Yao, Huijuan Wang, Haixu Li, Zhanfeng Cao, Guangcai Yuan, Xue Dong, Guoqiang Wang, Zhijun Lv
  • Publication number: 20230123660
    Abstract: A magnetic probe-based current measurement device and measurement method is disclosed. The device comprises a conductor for a current under test, a magnetic probe, a magnetic bias structure, and a programmable chip. A conductor has a first axis, a second axis, and a third axis. The conductor is provided with through holes. The direction of the through holes are parallel to the third axis. Vertical projections of the through holes on a first cross section are symmetric about the first axis. At least one of the through holes has a center position located on the first axis. And/or every pair of the through holes have center positions that are symmetric about the first axis. The magnetic probe is provided within the through holes, and is electrically connected to the programmable chip. A sensitive center position of the magnetic probe is located on the first cross section. A vertical projection of the magnetic probe on the first cross section is symmetric about the first axis.
    Type: Application
    Filed: March 24, 2021
    Publication date: April 20, 2023
    Applicant: MultiDimension Technology Co., Ltd.
    Inventors: Pin QU, Songsheng XUE, Huijuan WANG, Zongxin LIU
  • Patent number: 11600747
    Abstract: A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: March 7, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhiwei Liang, Yingwei Liu, Han Yue, Minghua Xuan, Hsuanwei Mai, Zhanfeng Cao, Ke Wang, Huijuan Wang, Guangcai Yuan, Zhijun Lv, Xinhong Lu
  • Patent number: 11437265
    Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: September 6, 2022
    Assignee: Beijing BOE Technology Development Co., Ltd.
    Inventors: Xue Dong, Guangcai Yuan, Zhijun Lv, Haixu Li, Zhiwei Liang, Huijuan Wang, Ke Wang, Zhanfeng Cao, Hsuanwei Mai
  • Patent number: 11430913
    Abstract: The present disclosure relates to the field of LED display technologies, and provides an LED chip, an LED light emitting substrate, a display device and a control method thereof. Specifically, the LED chip comprises: an N-type semiconductor layer, a P-type semiconductor layer, as well as a quantum well layer between the N-type semiconductor layer and the P-type semiconductor layer. The quantum well layer is made of indium gallium nitride, wherein indium atoms have a molar ratio of greater than or equal to 0.3 in the indium gallium nitride.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: August 30, 2022
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Huijuan Wang, Meili Wang, Zhenhua Lv, Fei Wang, Zezhou Yang
  • Patent number: 11391877
    Abstract: A backlight source is provided which includes a light guide plate 10 and a light-emitting unit 20. The light guide plate 10 includes a first surface and a second surface disposed oppositely. The light-emitting unit 20 is located on the side of the light guide plate where the first surface disposed. The grating layer 30 includes at least one grating unit configured to diffract light emitted by the light-emitting unit 20. The overall structure of the backlight source is no longer limited by the distance between the LEDs and the first layer diffusion layer, and therefore the thinning and lightening of the backlight source is realized. A manufacturing method of a backlight source and a display device are further provided.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: July 19, 2022
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Wei Wang, Huijuan Wang, Yafeng Yang, Xiaochuan Chen, Xue Dong, Xiandong Meng, Xianqin Meng, Jifeng Tan
  • Patent number: 11386845
    Abstract: A pixel unit circuit includes a light emitting element, a first end thereof being coupled to a low level input end; a storage capacitor module, a first end thereof being coupled to a direct current voltage input end; a driving transistor, a gate electrode thereof being coupled to a second end of the storage capacitor module, and a first electrode thereof being coupled to a second end of the light emitting element; a first control module, coupled to a gate line, a data line and the gate electrode of the driving transistor, configured to control whether the gate electrode of the driving transistor is connected to the data line under the control of the gate line; and a potential control transistor, a gate electrode and a first electrode thereof being coupled to the first electrode of the driving transistor, the second electrode thereof being grounded.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: July 12, 2022
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Shengji Yang, Xue Dong, Xiaochuan Chen, Hui Wang, Yanming Wang, Pengcheng Lu, Wei Liu, Huijuan Wang, Minghua Xuan
  • Patent number: 11341906
    Abstract: The present disclosure provides a pixel circuit and a drive method thereof, and a touch display apparatus. The pixel circuit includes a pixel driving circuit, an optical sensing circuit, and a light-emitting element. The pixel driving circuit is configured to drive the light-emitting element to emit light, based on a first control signal from a first control line, a second control signal from a second control line, a scanning signal from a scanning line, and a data signal from a data line. The optical sensing circuit is configured to sense an optical signal, convert the sensed optical signal into an electric signal, and output the electric signal via a reading line based on the first control signal, the second control signal, the scanning signal, and the data signal.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: May 24, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Shengji Yang, Xue Dong, Xiaochuan Chen, Minghua Xuan, Jing Yu, Yingzi Wang, Weifeng Han, Huijuan Wang