Patents by Inventor Hui Juan Yan

Hui Juan Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mounting techniques for fiber optics printed circuit board assemblies using metal coatings and tabs
    Patent number: 11320611
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: May 3, 2022
    Assignee: II-VI DELAWARE, INC.
    Inventors: Qing Qian, Wei Li, Hui Juan Yan, Hui Yang, Wei Peng Nian, Ting Shi
  • SURFACE MOUNTING TECHNIQUES FOR FIBER OPTICS PRINTED CIRCUIT BOARD ASSEMBLIES
    Publication number: 20210173158
    Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.
    Type: Application
    Filed: April 27, 2020
    Publication date: June 10, 2021
    Inventors: Qing Qian, Wei Li, Hui Juan Yan, Hui Yang, Wei Peng Nian, Ting Shi