Patents by Inventor Hui Kheng LIM

Hui Kheng LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11234945
    Abstract: Disclosed herein are pharmaceutical compositions comprising at least one polycationic aliphatic amine, in particular spermidine, spermine or a combination thereof. The compositions can further comprise one or more selected from decarboxylated S-adenosylmethionine and an inhibitor of ornithine decarboxylase 1 (ODC1) such as difluoromethyl ornithine (DFMO). Also disclosed herein are methods of determining the presence of a type of wound and methods for treating the same, i.e. acute or non-healing wounds, which in a particular embodiment, comprises determining the ratio of putrescine versus spermidine/spermine. The present disclosure also includes methods promoting re-epithelialisation of wounds and pharmaceutical compositions for the same use.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: February 1, 2022
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Leah Vardy, Hui Kheng Lim
  • Publication number: 20190262282
    Abstract: Disclosed herein are pharmaceutical compositions comprising at least one polycationic aliphatic amine, in particular spermidine, spermine or a combination thereof. The compositions can further comprise one or more selected from decarboxylated S-adenosylmethionine and an inhibitor of ornithine decarboxylase 1 (ODC1) such as difluoromethyl ornithine (DFMO). Also disclosed herein are methods of determining the presence of a type of wound and methods for treating the same, i.e. acute or non-healing wounds, which in a particular embodiment, comprises determining the ratio of putrescine versus spermidine/spermine. The present disclosure also includes methods promoting re-epithelialisation of wounds and pharmaceutical compositions for the same use.
    Type: Application
    Filed: July 3, 2017
    Publication date: August 29, 2019
    Inventors: Leah VARDY, Hui Kheng LIM