Patents by Inventor Hui-Kuan Mao

Hui-Kuan Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyurethane polymer having bisphenol group and photoimageable composition containing the same
    Patent number: 8835522
    Abstract: The present invention provides a polymer having the structure of formula (I) wherein n, R1, R2, R3, R4, R5, R6, a, b and c are as defined in the specification. The present invention also provides a negative-acting photoimageable composition comprising the above-mentioned polymer of formula (I), which is suitable for the fabrication of printed circuit boards.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: September 16, 2014
    Assignee: Eternal Chemical Co., Ltd.
    Inventors: Gerng-Horng Lin, Hui-Kuan Mao, Ming-Hsiung Yang, Feng-Chih Tsai
  • Polyurethane polymer having bisphenol group and photoimageable composition containing the same
    Publication number: 20070225467
    Abstract: The present invention provides a polymer having the structure of formula (I) wherein n, R1, R2, R3, R4, R5, R6, a, b and c are as defined in the specification. The present invention also provides a negative-acting photoimageable composition comprising the above-mentioned polymer of formula (I), which is suitable for the fabrication of printed circuit boards.
    Type: Application
    Filed: March 26, 2007
    Publication date: September 27, 2007
    Inventors: Gerng-Horng Lin, Hui-Kuan Mao, Ming-Hsiung Yang, Feng-Chih Tsai
  • Photoimageable composition
    Publication number: 20070004888
    Abstract: The present invention provides a negative-acting photoimageable composition comprising a polymeric binder, a photopolymerizable compound and a photoinitiator, wherein the polymeric binder contains as a polymerized unit at least one acrylate compound of the following formula: The photoimageable composition of the invention is suitable for the manufacture of printed circuit boards.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 4, 2007
    Inventors: Ming-Hsiung Yang, Hui-Kuan Mao, Feng-Chih Tsai