Abstract: A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.

Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer over a substrate and forming a dehydrated film over the photoresist layer. The photoresist layer is selectively exposed to actinic radiation to form an exposed portion and an unexposed portion of the photoresist layer. The photoresist layer is developed to remove the unexposed portion of the photoresist layer and a first portion of the dehydrated film over the unexposed portion of the photoresist layer. In an embodiment, the method includes etching the substrate by using the exposed portion of the photoresist layer as a mask.

Abstract: A diagnostic system applied to an electronic equipment with a plurality of hardware devices is provided. The hardware devices include a display and a processor, the diagnostic system is executed by the processor to diagnose the hardware devices. The diagnostic system includes a diagnostic test interface, which is displayed on the display and includes a plurality of hardware items corresponding to the hardware devices. Each of the hardware items links to the hardware devices. When at least one of the hardware items is triggered, the processor executes the diagnostic item of the hardware device corresponding to the triggered hardware item.

Abstract: A display device includes a circuit substrate, a plurality of pad sets and a plurality of light-emitting elements. The plurality of pad sets is disposed on the circuit substrate, and each pad set includes a first pad and a second pad surrounding the first pad. The plurality of light-emitting elements is disposed above the circuit substrate, and each light-emitting element includes a first electrode, a second electrode and a light-emitting stack between the first electrode and the second electrode, wherein the first electrode is electrically connected to the first pad, the second electrode is electrically connected to the second pad, and an orthographic projection of the second electrode on the circuit substrate is overlapped with an orthographic projection of the first pad on the circuit substrate.

Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode. If the amount of stored data in the flash memory module is greater than the first threshold when the communication interface receives the second data, the processing circuit controls the flash memory module so that the second data is written into the second data block under a two-bit-per-cell mode.

Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.

Abstract: A semiconductor structure includes a die and a first connector. The first connector is disposed on the die. The first connector includes a first connecting housing, a first connecting element and a first connecting portion. The first connecting element is electrically connected to the die and disposed at a first side of the first connecting housing. The first connecting portion is disposed at a second side different from the first side of the first connecting housing, wherein the first connecting portion is one of a hole and a protrusion with respect to a surface of the second side of the first connecting housing.

Abstract: A method for sharing a console variable setting of an application and the electronic device and system is provided. The sharing method includes: capturing a display frame of a first electronic device to obtain a set coding image by a second electronic device; transforming the set coding image into a meta file by the second electronic device, wherein the meta file comprises a set of setting parameters for a plurality of first setting options of a first application of the first electronic device; and setting a plurality of second setting options of a second application of the second electronic device as the set of setting parameters for the plurality of first setting options according to the meta file, wherein the second application is the same as the first application.

Abstract: A digital printing system incorporating in-track position corrections includes one or more printing subsystems, a data processing system; and a digital memory for storing a representation of an in-track position correction function, wherein the in-track position correction function is a non-linear function that specifies in-track position corrections to be applied as a function of cross-track position, and wherein the representation of the in-track position correction function includes the cross-track positions and transition direction of transitions in the in-track position correction function.

Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode. If the amount of stored data in the flash memory module is greater than the first threshold when the communication interface receives the second data, the processing circuit controls the flash memory module so that the second data is written into the second data block under a two-bit-per-cell mode.

Abstract: A digital printing system incorporating in-track position corrections includes one or more printing subsystems, a data processing system; and a digital memory for storing a representation of an in-track position correction function, wherein the in-track position correction function is a non-linear function that specifies in-track position corrections to be applied as a function of cross-track position, and wherein the representation of the in-track position correction function includes the cross-track positions and transition direction of transitions in the in-track position correction function.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A method for reducing artifacts in an electrophotographic printing system includes receiving a print job including image data for a set of pages. The electrophotographic printing system is used to print a block of pages from the print job to provide corresponding printed pages. The image data for the block of pages is analyzed to determine an average toner usage rate. If the determined average toner usage rate for the block of pages falls outside an acceptable toner usage rate range, image data for a compensation image and a number of compensation images are determined such that the average toner usage rate will be brought back into the acceptable toner usage rate range.

Abstract: A method for reducing image burn-in artifacts in an electrophotographic printing system, includes receiving a print job including image data for a set of pages to be printed. The pages are analyzed to determine that the image data for a sequence of pages in the print job are similar. The similar pages are printed using a pattern of lateral translations wherein the image data is laterally translated such that it is printed at a different lateral position on the printed page. The similar pages can also be printed using a pattern of page orientations including a first page orientation and a second page orientation, wherein the image data for the second page orientation is rotated 180 degrees relative to the image data for the first page orientation.

Abstract: An electrophotographic printing system for printing with a set of toners including a white toner. A plurality of printing modules are configured to print respective toner patterns, each including a toner image printed onto a receiver medium being transported on a transparent transport web and a corresponding registration mark positioned outside a border of the receiver medium. A registration mark sensing system is positioned to detect the printed registration marks. The registration mark sensing system includes a light detector positioned to detect light that is emitted by a light source, transmitted through the transport web and reflected off a non-white colored reflector plate positioned behind the transport web. The colored reflector plate has a color that provides detection signals for the registration marks having a magnitude that is greater than or equal to a predefined threshold.