Patents by Inventor Hui Leang Ong

Hui Leang Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9318399
    Abstract: Semiconductor wafers employing a fixed coordinate metrology scheme and methods for fabricating integrated circuits using the same are disclosed. In an exemplary embodiment, a semiconductor wafer employing a fixed-coordinate metrology scheme includes an external scribe region in the form of a first rectangular ring, the first rectangular ring defining a first interior space inward from the external scribe region and an interior scribe region in the form of a second rectangular ring, disposed within the first interior space and immediately adjacent to the external scribe region at all points along its exterior perimeter, the second rectangular ring defining a second interior space inward from the interior scribe region, the second interior space being wholly within the first interior space.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: April 19, 2016
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Soon Yoeng Tan, Hui Leang Ong
  • Publication number: 20150179535
    Abstract: Semiconductor wafers employing a fixed coordinate metrology scheme and methods for fabricating integrated circuits using the same are disclosed. In an exemplary embodiment, a semiconductor wafer employing a fixed-coordinate metrology scheme includes an external scribe region in the form of a first rectangular ring, the first rectangular ring defining a first interior space inward from the external scribe region and an interior scribe region in the form of a second rectangular ring, disposed within the first interior space and immediately adjacent to the external scribe region at all points along its exterior perimeter, the second rectangular ring defining a second interior space inward from the interior scribe region, the second interior space being wholly within the first interior space.
    Type: Application
    Filed: December 19, 2013
    Publication date: June 25, 2015
    Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Soon Yoeng Tan, Hui Leang Ong