Abstract: The invention provides a heat dissipating device comprising: a heat generating unit, which generates heat when under operation and is placed at a first side of the heat dissipating device; a heat sensitive object, which is placed at a second side of the heat dissipating device; and an air layer, which is arranged in between the heat generating unit and the heat sensitive object. The heat generated by the heat generating unit is isolated by the air layer.

Abstract: The invention provides a heat dissipating device comprising: a heat generating unit, which generates heat when under operation and is placed at a first side of the heat dissipating device; a heat sensitive object, which is place at a second side of the heat dissipating device; and an air layer, which is arranged in between the heat generating unit and the heat sensitive object. The heat generated by the heat generating unit is isolated by the air layer.

Abstract: A heat dissipating structure generally utilized in a telecommunication product includes a plurality of PCB modules, a metal framework, a top lid, and a perforated panel. The heat dissipating structure is generally utilized in a telecommunication product. The plurality of PCB modules are coupled in series and configured to form a chassis. The metal framework is housed within the chassis and forms an internal chamber. The top lid is disposed at a top side of the heat dissipating structure. The perforated panel is disposed below the top lid and over the internal chamber. The perforated panel includes a plurality of ventilation holes. The internal chamber cooperates with the plurality of ventilation holes to dissipate heat.

Abstract: A heat dissipating structure generally utilized in a telecommunication product includes a plurality of PCB modules, a metal framework, a top lid, and a perforated panel. The heat dissipating structure is generally utilized in a telecommunication product. The plurality of PCB modules are coupled in series and configured to form a chassis. The metal framework is housed within the chassis and forms an internal chamber. The top lid is disposed at a top side of the heat dissipating structure. The perforated panel is disposed below the top lid and over the internal chamber. The perforated panel includes a plurality of ventilation holes. The internal chamber cooperates with the plurality of ventilation holes to dissipate heat.