Patents by Inventor Hui Ling Pan

Hui Ling Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11600754
    Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 7, 2023
    Assignee: Lumileds LLC
    Inventors: Hua Sin Yew, Hui Ling Pan, Xinping Yan
  • Publication number: 20200161521
    Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).
    Type: Application
    Filed: November 25, 2019
    Publication date: May 21, 2020
    Inventors: Hua Sin Yew, Hui Ling Pan, Xinping Yan
  • Patent number: 10168015
    Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: January 1, 2019
    Assignee: Koninklijke Philips N.V.
    Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
  • Patent number: 9905544
    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: February 27, 2018
    Assignee: Lumileds LLC
    Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
  • Patent number: 9773762
    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: September 26, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
  • Publication number: 20170241611
    Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
    Type: Application
    Filed: May 18, 2015
    Publication date: August 24, 2017
    Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
  • Publication number: 20170092628
    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 30, 2017
    Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
  • Patent number: 9530949
    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: December 27, 2016
    Assignee: Koninklijke Philips N.V.
    Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
  • Publication number: 20160329473
    Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.
    Type: Application
    Filed: June 18, 2014
    Publication date: November 10, 2016
    Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
  • Patent number: D738006
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: September 1, 2015
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Hui Ling Pan, Jin Cherl Kwon, Sze Kuang Lee, Albrecht Johannes Kraus, Paul Scott Martin, Chao Ding
  • Patent number: D738007
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: September 1, 2015
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Hui Ling Pan, Jin Cherl Kwon, Sze Kuang Lee, Albrecht Johannes Kraus, Paul Scott Martin, Chao Ding
  • Patent number: D740983
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: October 13, 2015
    Assignee: Koninklijke Philips N.V.
    Inventors: Hui Ling Pan, Jin Cherl Kwon, Hiu Tung Chu, Hua Sin Yew
  • Patent number: D771845
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: November 15, 2016
    Assignee: Koninklijke Philips N.V.
    Inventors: Shengjin Chen, Hui Ling Pan, Xiaobo Zhang, Chunheng Kang, Shichun Liu
  • Patent number: D793586
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: August 1, 2017
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Shengjin Chen, Hui Ling Pan, Xiaobo Zhang, Chunheng Kang, Shichun Liu
  • Patent number: D803430
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: November 21, 2017
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Sheng Jin Chen, Long Yin, Shi Chun Liu, Yang Guang Zhao, Chun Heng Kang, Hui Ling Pan, Xiao Bo Zhang
  • Patent number: D827880
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: September 4, 2018
    Assignee: Lumileds Holding B.V.
    Inventors: Sheng Jin Chen, Xin Sheng, Shanhai Guo, Lan Li, Chun Heng Kang, Hui Ling Pan, Yuanyuan Wang
  • Patent number: D854715
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: July 23, 2019
    Assignee: Lumileds Holding B.V.
    Inventors: Chunheng Kang, Lan Li, Hui Ling Pan, Shanhai Guo, Xin Sheng, Yuanyuan Wang, Shengjin Chen, Fangzhong Shen