Patents by Inventor Hui Ling Pan
Hui Ling Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11600754Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).Type: GrantFiled: November 25, 2019Date of Patent: March 7, 2023Assignee: Lumileds LLCInventors: Hua Sin Yew, Hui Ling Pan, Xinping Yan
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Publication number: 20200161521Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).Type: ApplicationFiled: November 25, 2019Publication date: May 21, 2020Inventors: Hua Sin Yew, Hui Ling Pan, Xinping Yan
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Patent number: 10168015Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.Type: GrantFiled: May 18, 2015Date of Patent: January 1, 2019Assignee: Koninklijke Philips N.V.Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
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Patent number: 9905544Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.Type: GrantFiled: December 9, 2016Date of Patent: February 27, 2018Assignee: Lumileds LLCInventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
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Patent number: 9773762Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.Type: GrantFiled: December 9, 2016Date of Patent: September 26, 2017Assignee: Koninklijke Philips N.V.Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
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Publication number: 20170241611Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.Type: ApplicationFiled: May 18, 2015Publication date: August 24, 2017Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
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Publication number: 20170092628Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.Type: ApplicationFiled: December 9, 2016Publication date: March 30, 2017Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
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Patent number: 9530949Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.Type: GrantFiled: June 18, 2014Date of Patent: December 27, 2016Assignee: Koninklijke Philips N.V.Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
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Publication number: 20160329473Abstract: In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.Type: ApplicationFiled: June 18, 2014Publication date: November 10, 2016Inventors: Sze Kuang Lee, Paul Scott Martin, Albrecht Johannes Kraus, Chunheng Kang, Hui Ling Pan, Long Yin
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Patent number: D738006Type: GrantFiled: April 23, 2014Date of Patent: September 1, 2015Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Hui Ling Pan, Jin Cherl Kwon, Sze Kuang Lee, Albrecht Johannes Kraus, Paul Scott Martin, Chao Ding
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Patent number: D738007Type: GrantFiled: April 23, 2014Date of Patent: September 1, 2015Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Hui Ling Pan, Jin Cherl Kwon, Sze Kuang Lee, Albrecht Johannes Kraus, Paul Scott Martin, Chao Ding
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Patent number: D740983Type: GrantFiled: April 23, 2014Date of Patent: October 13, 2015Assignee: Koninklijke Philips N.V.Inventors: Hui Ling Pan, Jin Cherl Kwon, Hiu Tung Chu, Hua Sin Yew
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Patent number: D771845Type: GrantFiled: July 15, 2015Date of Patent: November 15, 2016Assignee: Koninklijke Philips N.V.Inventors: Shengjin Chen, Hui Ling Pan, Xiaobo Zhang, Chunheng Kang, Shichun Liu
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Patent number: D793586Type: GrantFiled: July 15, 2015Date of Patent: August 1, 2017Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Shengjin Chen, Hui Ling Pan, Xiaobo Zhang, Chunheng Kang, Shichun Liu
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Patent number: D803430Type: GrantFiled: July 11, 2014Date of Patent: November 21, 2017Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Sheng Jin Chen, Long Yin, Shi Chun Liu, Yang Guang Zhao, Chun Heng Kang, Hui Ling Pan, Xiao Bo Zhang
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Patent number: D827880Type: GrantFiled: November 17, 2016Date of Patent: September 4, 2018Assignee: Lumileds Holding B.V.Inventors: Sheng Jin Chen, Xin Sheng, Shanhai Guo, Lan Li, Chun Heng Kang, Hui Ling Pan, Yuanyuan Wang
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Patent number: D854715Type: GrantFiled: February 28, 2018Date of Patent: July 23, 2019Assignee: Lumileds Holding B.V.Inventors: Chunheng Kang, Lan Li, Hui Ling Pan, Shanhai Guo, Xin Sheng, Yuanyuan Wang, Shengjin Chen, Fangzhong Shen