Patents by Inventor Hui-Ling Zhang
Hui-Ling Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140102687Abstract: A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface.Type: ApplicationFiled: December 17, 2013Publication date: April 17, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Tsinghua UniversityInventors: FENG-WEI DAI, YUAN YAO, YOU-SEN WANG, JI-CUN WANG, HUI-LING ZHANG
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Patent number: 8642121Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.Type: GrantFiled: October 8, 2009Date of Patent: February 4, 2014Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
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Patent number: 8437136Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: GrantFiled: October 14, 2009Date of Patent: May 7, 2013Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Patent number: 8221667Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.Type: GrantFiled: October 13, 2009Date of Patent: July 17, 2012Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang, You-Sen Wang, Chang-Hong Liu
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Patent number: 8081469Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: GrantFiled: October 14, 2009Date of Patent: December 20, 2011Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20100301260Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.Type: ApplicationFiled: October 8, 2009Publication date: December 2, 2010Applicants: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20100302739Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: ApplicationFiled: October 14, 2009Publication date: December 2, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20100273946Abstract: A carbon nanotube microcapsule includes at least one carbon nanotube and a shell encapsulating the at least one carbon nanotube. The shell includes a plurality of first functional groups. A composite using the carbon nanotube microcapsule, and a method for making the carbon nanotube microcapsule is also disclosed.Type: ApplicationFiled: September 22, 2009Publication date: October 28, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HUI-LING ZHANG, YUAN YAO, JI-CUN WANG, YOU-SEN WANG, FENG-WEI DAI
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Publication number: 20100219550Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.Type: ApplicationFiled: October 13, 2009Publication date: September 2, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG, YOU-SEN WANG, CHANG-HONG LIU
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Publication number: 20100157538Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: ApplicationFiled: October 14, 2009Publication date: June 24, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YOU-SEN WANG, YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG