Patents by Inventor Hui-Lung Chien

Hui-Lung Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210289661
    Abstract: A heat dissipation device adapted to dissipate heat of a heat source in an electronic system. The heat dissipation device includes a thermally conductive plastic shell and a fluid. The thermally conductive plastic shell has at least one sealed accommodation space. The fluid completely fills the at least one sealed accommodation space of the thermally conductive plastic shell.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 16, 2021
    Applicant: Zyxel Networks Corporation
    Inventors: Lu-Wei Chiang, Liang-Wei Chen, Hui-Lung Chien