Patents by Inventor HUI-MING PAO

HUI-MING PAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer transport system and method for operating the same
    Patent number: 9786535
    Abstract: The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.
    Type: Grant
    Filed: November 30, 2014
    Date of Patent: October 10, 2017
    Assignee: GUDENG PRECISION INDUSTRIAL CO., LTD.
    Inventors: Hui-Ming Pao, Cheng-Hsin Chen, Po-Ting Lee, Ming-Chien Chiu, Tien-Jui Lin
  • WAFER TRANSPORT SYSTEM AND METHOD FOR OPERATING THE SAME
    Publication number: 20150340260
    Abstract: The present invention relates to a wafer transport system and a method of operating the same. The wafer transport system comprises at least one semiconductor apparatus, a track, a transfer device, a positioning device, a carrier and a cleaning device. The wafer transport system transports wafers along the at least one semiconductor apparatus via the carrier riding on the track. The transfer device transfers the wafers from the carrier to the at least one semiconductor apparatus. The positioning device identifies and controls the position of the carrier on the track. The cleaning device maintains the cleanliness of the wafers. The present invention provides advantages for improving the yield rate of a wafer, shortening the fabrication time of a wafer, and offering the flexibility and the extendibility to a wafer transport system.
    Type: Application
    Filed: November 30, 2014
    Publication date: November 26, 2015
    Inventors: HUI-MING PAO, CHENG-HSIN CHEN, PO-TING LEE, MING-CHIEN CHIU, TIEN-JUI LIN