Abstract: A lorry and a lorry tank are provided. The lorry tank includes a tank body and one or two return tube(s). The tank body has at least one manhole, at least one air hole, a liquid hole and a circulation hole that are communicated to a storage space inside the tank body. One end of the return tube is connected to the circulation hole, and another end of the return tube extends to the storage space.

Abstract: A wafer bumping method comprising the following steps of. A wafer having fields is provided. The wafer having at least one wafer identification character formed thereon within one or more of the fields. A dry film resist is formed over the wafer. Portions of the dry film resist are selectively exposed field by field using a mask whereby the mask is shifted over the one or more fields containing the at least one wafer identification character so that the one or more fields containing the at least one wafer identification character is double exposed after the mask shift so that all of the one or more fields containing the at least one wafer identification character is completely exposed. The selectively exposed dry film resist is developed to remove the non-exposed portions of the dry film resist.