Patents by Inventor Hui-Ping JIAN

Hui-Ping JIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method of manufacturing the same
    Patent number: 12237272
    Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: February 25, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hui-Ping Jian, Ming-Hung Chen, Jia-Feng Ho
  • ELECTRONIC WEARABLE DEVICE
    Publication number: 20240126327
    Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
  • ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230187374
    Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hui-Ping JIAN, Ming-Hung CHEN, Jia-Feng HO
  • Semiconductor device package including conductive layers as shielding and method of manufacturing the same
    Patent number: 11302647
    Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Hui-Ping Jian, Wei-Zhen Qiu
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210358859
    Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.
    Type: Application
    Filed: May 14, 2020
    Publication date: November 18, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Hui-Ping JIAN, Wei-Zhen QIU