Patents by Inventor Hui-Ping Lin

Hui-Ping Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210138697
    Abstract: A shaping material extruding hollow module fabricating equipment of foamed shaping material having enclosing veneer comprises: a primary machinery, including a shaping material foaming mold allowing a foamed shaping material to be foamed, and disposed with a thermostat device and a blowing pipe; a shaping mold of formation platform, disposed with cooling water passageways and vacuum air passageways; a vacuum shaping mold of formation platform, disposed with cooling water passageways and vacuum air passageways; a shaping water tank mold for flattening the surface of shaping material, disposed with a water tank, a vacuum pump and a shaping block; a secondary machinery, disposed with a shaping material enclosing mold allowing the outer periphery of foamed shaping material to be enclosed by an enclosing veneer of non-foamed plastic and including a thermostat device; a towing device; a cutting device; and a shaping material storage rack adjacently disposed with a detecting device.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 13, 2021
    Inventor: Hui-Ping LIN
  • Patent number: 8522893
    Abstract: A modularized ultrasonic vibration machining apparatus is provided, which includes a tool holder module. The tool holder module further includes: a housing, having a positioning pin disposed thereon; a tool holder linking part, disposed in the housing; a transmitting mechanism, disposed in the housing and linked to the tool holder linking part in a transmission manner; an expanding device, disposed in the housing and linked to the transmitting mechanism in a transmission manner; a piezoelectric element, disposed in the housing and linked to the expanding device; and an electrical connector, disposed in the housing and electrically connected to the piezoelectric element and the positioning pin. Therefore, the modularized tool holder has an internal vibration mechanism and closed circuit setting of power supply, is capable of being assembled and applied conveniently, and has good security, economical efficiency, and applicability in industry.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: September 3, 2013
    Assignee: Metal Industries Research & Development Centre
    Inventors: Zhong-Yi Yang, Hui-Ping Lin
  • Publication number: 20110155407
    Abstract: A modularized ultrasonic vibration machining apparatus is provided, which includes a tool holder module. The tool holder module further includes: a housing, having a positioning pin disposed thereon; a tool holder linking part, disposed in the housing; a transmitting mechanism, disposed in the housing and linked to the tool holder linking part in a transmission manner; an expanding device, disposed in the housing and linked to the transmitting mechanism in a transmission manner; a piezoelectric element, disposed in the housing and linked to the expanding device; and an electrical connector, disposed in the housing and electrically connected to the piezoelectric element and the positioning pin. Therefore, the modularized tool holder has an internal vibration mechanism and closed circuit setting of power supply, is capable of being assembled and applied conveniently, and has good security, economical efficiency, and applicability in industry.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 30, 2011
    Applicant: METAL INDUSTRIES RESEARCH&DEVELOPMENT CENTRE
    Inventors: Zhong-Yi YANG, Hui-Ping Lin