Patents by Inventor Hui-Ping Peng

Hui-Ping Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer stack separator
    Publication number: 20060105498
    Abstract: An integrated circuit wafer container and separator combination. The separator comprises a substantially flat main area and a plurality of elevated projections in the periphery thereof. The elevated projections sustain the weight of the wafer stacks, avoid vacuum adhesion, and minimize contact with wafers.
    Type: Application
    Filed: August 13, 2004
    Publication date: May 18, 2006
    Inventors: Cheng-Chung Huang, Tzu-Yen Lin, Hui-Ping Peng