Patents by Inventor Hui-Ru WU
Hui-Ru WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230413594Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: ApplicationFiled: September 4, 2023Publication date: December 21, 2023Inventors: Hui-Ru WU, Jian-Chin LIANG, Jo-Hsiang CHEN, Lung-Kuan LAI, Cheng-Yu TSAI, Hsin-Lun SU, Ting-Kai CHEN
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Patent number: 11778845Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: GrantFiled: May 15, 2022Date of Patent: October 3, 2023Assignee: Lextar Electronics CorporationInventors: Hui-Ru Wu, Jian-Chin Liang, Jo-Hsiang Chen, Lung-Kuan Lai, Cheng-Yu Tsai, Hsin-Lun Su, Ting-Kai Chen
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Publication number: 20230070973Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.Type: ApplicationFiled: September 7, 2022Publication date: March 9, 2023Inventors: Chih-Hao LIN, Jo-Hsiang CHEN, Wei-Yuan MA, Hui-Ru WU, Min-Che TSAI, Shiou-Yi KUO, Jian-Chin LIANG
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Patent number: 11552222Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.Type: GrantFiled: May 21, 2020Date of Patent: January 10, 2023Assignee: Lextar Electronics CorporationInventors: Chih-Hao Lin, Hui-Ru Wu, Jo-Hsiang Chen, Jian-Chin Liang, Ai-Sen Liu
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Publication number: 20220271251Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: ApplicationFiled: May 15, 2022Publication date: August 25, 2022Inventors: Hui-Ru WU, Jian-Chin LIANG, Jo-Hsiang CHEN, Lung-Kuan LAI, Cheng-Yu TSAI, Hsin-Lun SU, Ting-Kai CHEN
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Patent number: 11367849Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: GrantFiled: December 25, 2018Date of Patent: June 21, 2022Assignee: Lextar Electronics CorporationInventors: Hui-Ru Wu, Jian-Chin Liang, Jo-Hsiang Chen, Lung-Kuan Lai, Cheng-Yu Tsai, Hsin-Lun Su, Ting-Kai Chen
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Publication number: 20210367113Abstract: The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.Type: ApplicationFiled: May 21, 2020Publication date: November 25, 2021Inventors: Chih-Hao LIN, Hui-Ru WU, Jo-Hsiang CHEN, Jian-Chin LIANG, Ai-Sen LIU
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Publication number: 20200067009Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: ApplicationFiled: December 25, 2018Publication date: February 27, 2020Inventors: Hui-Ru WU, Jian-Chin LIANG, Jo-Hsiang CHEN, Lung-Kuan LAI, Cheng-Yu TSAI, Hsin-Lun SU, Ting-Kai CHEN
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Patent number: 10386629Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 ?m.Type: GrantFiled: October 10, 2017Date of Patent: August 20, 2019Assignee: LEXTAR ELECTRONICS CORPORATIONInventors: Chih-Hao Lin, Hui-Ru Wu, Jo-Hsiang Chen, Tzong-Liang Tsai
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Publication number: 20180106994Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 ?m.Type: ApplicationFiled: October 10, 2017Publication date: April 19, 2018Inventors: Chih-Hao LIN, Hui-Ru WU, Jo-Hsiang CHEN, Tzong-Liang TSAI