Abstract: A high-speed cable connector includes a housing, a PCB fixed in the housing, a cable electrically connected to the PCB and a snap-fit member. The snap-fit member includes a main body portion and a clasp portion. The main body portion includes a fixing portion, a lever arm rotating portion formed by bending upwards from the tail end of the fixing portion, and a pressing portion fixedly connected to the end of the lever arm rotating portion. The fixing portion is fixedly installed on the top of the housing. The clasp portion includes two clasp arms on two sides of the pressing portion and fixedly connected to the pressing portion. The ends of the clasp arms are respectively provided with a clasp protruding upwards. The height of the clasp is reduced by pressing the pressing portion and the unlocking of the connector is finally completed.

Abstract: The present disclosure relates to a method for quickly identifying disconnection of a Current Transformer (CT) in protection of a 3/2 connection mode based bus. The present disclosure can quickly and accurately identify the disconnection of the CT, thereby avoiding the problem of a maloperation in protection of a bus caused by the disconnection of the CT.

Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device includes a substrate and a multiple-stack staircase structure. The multiple-stack staircase structure can include a plurality of staircase structures stacked over the substrate. Each one of the plurality of staircase structures can include a plurality of conductor layers each between two insulating layers. The memory device can also include a filling structure over the multiple-stack staircase structure, a semiconductor channel extending through the multiple-stack staircase structure, and a supporting pillar extending through the multiple-stack staircase structure and the filling structure. The semiconductor channel can include unaligned sidewall surfaces, and the supporting pillar can include aligned sidewall surfaces.

Abstract: Embodiments of a method for forming a staircase structure of 3D memory devices are disclosed. The method comprises (i) forming an alternating layer stack including multiple layers disposed on a substrate in a vertical direction; (ii) removing a portion of the alternating layer stack to form multiple step-platforms in a staircase region of the alternating layer stack; (iii) forming a hard mask layer to cover top surfaces of the step-platforms; (iv) forming multiple openings in the hard mask layer to expose a portion of each of the step-platforms; (v) forming a photoresist layer to cover the top surfaces of the step-platforms and the hard mask layer; (vi) using a same set of trim-etch processes to pattern the photoresist layer to form a set of staircases on each of the step-platforms; (vii) removing the photoresist layer and the hard mask layer; and repeating (iii), (iv), (v), (vi) and (vii) sequentially.

Abstract: A method of modifying an integrated circuit includes operations related to identifying at least two fin-containing functional areas of the integrated circuit, generating a performance curve for each fin-containing functional area of the integrated circuit for each fin height of a series of fin heights, and determining whether an inflection point exists for each performance curve. The method further includes operations related to selecting a value of a performance characteristic for each of the fin-containing functional areas, the selected value having a corresponding fin height in each of the fin-containing functional areas, modifying each fin-containing functional area to have the fin height corresponding to the selected value of the performance characteristic; and combining the modified fin-containing functional areas to form a modified integrated circuit.

Abstract: An ultra high speed signal cable connector includes an insulating housing, a PCB fixedly mounted inside the insulating housing, and at least one row of cables without grounding wires welded to the PCB. The end portion of a connecting finger of the PCB extends out of the insulating housing, and the PCB is provided with a signal bonding pad and a grounding wire bonding pad. Each cable without grounding wires includes a plurality of electric wires, a conductive jacket for wrapping the plurality of electric wires together, and an insulating jacket wrapped on the outer layer of the conductive jacket. Each electric wire includes a core wire and an insulating layer wrapped on the outer layer of the core wire. One ends of the core wires are welded on the signal bonding pad; a section of insulating jacket is stripped from the foremost end of each cable without grounding wires to expose the conductive jacket. The conductive jackets are electrically and fixedly connected to the grounding wire bonding pad.

Abstract: Methods for image segmentation and smoothing of image segmentations are provided. In various embodiments, a plurality of training images is provided to a segmentation network. A candidate segmentation is obtained from the segmentation network for each of the plurality of training images. Each candidate segmentation is compared to a ground truth segmentation to compute a loss metric for each candidate segmentation. Based on the gradient of the loss, the segmentation network is trained to minimize level set smoothing energy. In various embodiments, an input image is downsampled from a first resolution to a second, lower resolution. The downsampled image is provided to a segmentation network. A segmentation at the second resolution is obtained from the segmentation network. The segmentation from the second resolution is upsampled to the first resolution. The input image and the upsampled segmentation are provided at the first resolution to a convolutional network.

Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device includes a first alternating conductor/dielectric stack disposed on the substrate and a layer of silicon carbide disposed over the first alternating conductor/dielectric stack. A second alternating conductor/dielectric stack is disposed on the silicon carbide layer. The memory device includes one or more first structures extending orthogonally with respect to the surface of the substrate through the first alternating conductor/dielectric stack and over the epitaxially-grown material disposed in the plurality of recesses, and one or more second structures extending orthogonally with respect to the surface of the substrate through the second alternating conductor/dielectric stack. The one or more second structures are substantially aligned over corresponding ones of the one or more first structures.

Abstract: A machining center includes a machine bed, a work table unit, a sliding unit, a first driving unit, a conveying member, a second driving unit and a loading seat. The machine bed has a machining zone and a transferring zone. The first driving unit is operable for driving the conveying member to move along a conveying axis which extends in a first direction, thereby driving the loading seat to move along first adjusting axes which extend in the first direction between the transferring and machining zones. The second driving unit is operable for driving the loading seat to move along second adjusting axes which extend in a second direction, which is perpendicular to the first direction and which is substantially vertical.

Abstract: Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a semiconductor substrate, an alternating layer stack disposed on the semiconductor substrate, and a dielectric structure, which extends vertically through the alternating layer stack, on an isolation region of the substrate. Further, the alternating layer stack abuts a sidewall surface of the dielectric structure and the dielectric structure is formed of a dielectric material. The 3D memory device additionally includes one or more through array contacts that extend vertically through the dielectric structure and the isolation region, and one or more channel structures that extend vertically through the alternating layer stack.

Abstract: Embodiments of a method for forming a staircase structure of 3D memory devices are disclosed. The method comprises (i) forming an alternating layer stack including multiple layers disposed on a substrate in a vertical direction; (ii) removing a portion of the alternating layer stack to form multiple step-platforms in a staircase region of the alternating layer stack; (iii) forming a hard mask layer to cover top surfaces of the step-platforms; (iv) forming multiple openings in the hard mask layer to expose a portion of each of the step-platforms; (v) forming a photoresist layer to cover the top surfaces of the step-platforms and the hard mask layer; (vi) using a same set of trim-etch processes to pattern the photoresist layer to form a set of staircases on each of the step-platforms; (vii) removing the photoresist layer and the hard mask layer; and repeating (iii), (iv), (v), (vi) and (vii) sequentially.

Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device includes a substrate having one or more first recesses in a first region and one or more second recesses in a second region. A liner layer is disposed over the sidewalls and bottom of the one or more first recesses in the first region and an epitaxially-grown material is formed in the one or more second recesses in the second region. One or more NAND strings are formed over the epitaxially-grown material disposed in the one or more second recesses, and one or more vertical structures are formed over the one or more first recesses in the first region.

Abstract: A ureteral stent is provided. The stent may include a first section having a first wall defining a first luminal section. The stent may further include a second section having a second wall defining a second luminal section. The second section can be enabled to substantially close at times external pressure is applied to the stent.

Abstract: Automatic characterization of the Agatston score from coronary computed tomography (CT) is provided. In various embodiments, a plurality of coronary computed tomography images are segmented into a plurality of segments corresponding to features of coronary anatomy. A plurality of calcium candidates are extracted from the plurality of coronary computed tomography images by thresholding. Coronary calcification is located in the coronary computed tomography images by applying a trained classifier to the plurality of calcium candidates. An Agatson score is computed from the located calcification.

Abstract: A method comprises (a) collecting (i) a set of chest computed tomography angiography (CTA) images scanned in the axial view and (ii) a manual segmentation of the images, for each one of multiple organs; (b) preprocessing the images such that they share the same field of view (FOV); (c) using both the images and their manual segmentation to train a supervised deep learning segmentation network, wherein loss is determined from a multi-dice score that is the summation of the dice scores for all the multiple organs, each dice score being computed as the similarity between the manual segmentation and the output of the network for one of the organs; (d) testing a given (input) pre-processed image on the trained network, thereby obtaining segmented output of the given image; and (e) smoothing the segmented output of the given image.

Abstract: An electrical connector includes: an insulative housing; a terminal module received by the insulative housing, the terminal module including an insulator, a plurality of terminals, and an internal, horizontal printed circuit board (PCB) carrying plural magnetic components; and a shielding shell enclosing the insulative housing and the PCB, wherein the insulative housing has a pair of restraining slots receiving a front of the insulator, and the shielding shell has a pair of abutting arms received between the insulator and the PCB.

Abstract: A ureteral stent that includes a tubular member and a retaining end adapted to be placed inside a kidney or a bladder of a patient. The retaining end includes a plurality of loops. Each of the loops are centered about a loop axis, and two or more of the loop axes extend in different directions relative to other loop axes.

Abstract: Automatic characterization of the Agatston score from coronary computed tomography (CT) is provided. In various embodiments, a plurality of coronary computed tomography images are segmented into a plurality of segments corresponding to features of coronary anatomy. A plurality of calcium candidates are extracted from the plurality of coronary computed tomography images by thresholding. Coronary calcification is located in the coronary computed tomography images by applying a trained classifier to the plurality of calcium candidates. An Agatson score is computed from the located calcification.

Abstract: The invention provides a set top box with karaoke functions. The invention consists of a video and audio real-time casting function processor, an audio/video decoding processor with high definition multimedia interface technology and an audio remix processor. Therefore, the multimedia image can be projected onto a large screen and the output audio and the microphone sound can be mixed together and then output to the audio equipment, so as to achieve a better karaoke singing result.

Abstract: The present disclosure involves occasions where precise two-dimensional motion takes place, and is applicable to XY motion stages for precise displacement compensation. The present disclosure particularly involves a stiffness-frequency adjustable XY micromotion stage based on stress stiffening, which includes X-direction and Y-direction motion sub-stages and corresponding drivers and a micromotion working table. The micromotion stage uses membrane sets that have tension levels thereof adjusted by bolts as a flexible hinge, so as to achieve independent adjustment of the vibration frequency of the XY micromotion stage. The present disclosure implements the foregoing configuration based on prestressed membrane, so the frequency is adjustable. The inherent frequency of the micromotion stage can be adjusted before or during operation according to various working conditions and driving frequency.