Abstract: Methods, systems, and devices for analyzing communication messages (e.g., emails) and selecting corresponding actions are described. In some database systems, a user may receive multiple messages at a user device. To efficiently determine responses to these messages, the user device may send the messages to a backend server for analysis. The server may perform natural language processing (NLP) to classify the message with one or more binary classifications and may extract metadata from each message. Based on the classifications and the metadata, the server may determine one or more actions the user device may perform to respond to each message. The server may send instructions to the user device indicating the suggested actions, and the user device may display these actions as options to a user. Additionally, the user device may use the classifications and metadata to automatically generate one or more communication templates in response to the message.

Abstract: A body information analysis apparatus (1) and a method of simulating face shape by using same are provided. The method includes reading a predetermined value of a face shape variable from a memory (17) wherein the face shape variable corresponds to one of a plurality of target face shapes; causing an image fetching module (12) to take a picture and converting same into a digital image; causing a processing unit (10) to identify a face (6) in the digital image and position a plurality of parts of the face (6); determining an original face shape of the face (6) based on the plurality of parts thereof; performing deformation on the face (6) based on the original face shape thereof to generate a simulated face image (80) wherein a face shape variable of the simulate face image (80) complies with the predetermined value; and outputting the simulated face image (80).

Abstract: A body information analysis apparatus (1) and a method of detecting face shape by using same are provided. The apparatus (1) includes an image fetching module (12); a display module (111); a processing unit (10) including a face analysis module (500) for positioning two eyebrows, a mouth and first features (711, 712) of a face contour in response to an identified face wherein the first features (711, 712) are at two sides of the face respectively; a first calculation module (501) for calculating a vertical distance between the mouth and either eyebrow and taking same as a first distance (D1), calculating a horizontal distance between the first features (711, 712) and taking same as a second distance (D2), and calculating a first ratio of the first distance (D1) to the second distance (D2); a face detection module (511) for determining the face shape; and an information creation module (504).

Abstract: A body information analysis apparatus (1) and method of analyzing hand skin by using same are provided. The method includes activating an image fetching module (12) of the body information analysis apparatus (1) to record an external image (61); activating a processing unit (10) of the body information analysis apparatus (1) to recognize one of a plurality of hand images (81, 82, 83, 84, 85, 86, 87, 88) in the external image (61); recognizing an image in one of the hand images (81, 82, 83, 84, 85, 86, 87, 88) corresponding to a defect; marking one of the hand images (81, 82, 83, 84, 85, 86, 87, 88) based on a location of the image having a defect; and activating a display module (111) of the body information analysis apparatus (1) to show the marked one of the hand images (81, 82, 83, 84, 85, 86, 87, 88).

Abstract: A body information analysis apparatus capable of indicating shading-areas includes: an image capturing module (12) for capturing an external image; a processor (10) electrically connected to the imager capturing module (12), stored multiple face types and multiple indicating processes respectively corresponding to each of the face types, wherein the processor (10) determines a face type of a face when the face is recognized in the external image, and executes one of the multiple indicating processes corresponding to the determined face type, so as to indicate shading-areas on the face; and, a display module (111) electrically connected to the processor (10), for displaying the indicated shading-areas and the image of the face simultaneously.

Abstract: A body information analysis apparatus (1) capable of indicating blush areas (A1-A4)is disclosed and includes: an image capturing module (12) for capturing an external image; a processor (10) electrically connected to the image capturing module (12), stored multiple face types and multiple indicating processes respectively corresponding to each of the face types, the processor (10) determines a face type of a face when the face is recognized in the external image, and executes one of the multiple indicating processes corresponding to the determined face type, so as to indicate blush areas (A1-A4) on the face; and, a display module (111) electrically connected to the processor (10), for displaying the face in company with the indicated blush areas (A1-A4).

Abstract: A hybrid switch apparatus includes a gate drive circuit producing a gate drive signal, a GaN high electron mobility transistor (HEMT) having a first gate, a first drain, and a first source. A silicon (Si) MOSFET has a second gate, a second drain, and a second source. The GaN HEMT and the Si MOSFET are connected in a parallel arrangement so that (i) the first drain and the second drain are electrically connected and (ii) the first source and the second source are electrically connected. The second gate is connected to the gate drive circuit output to receive the gate drive signal. A delay block has an input connected to the gate drive circuit output and an delay block output is configured to produce a delayed gate drive signal for driving the GaN HEMT.

Abstract: A hybrid switch apparatus includes a gate drive circuit producing a gate drive signal, a GaN high electron mobility transistor (HEMT) having a first gate, a first drain, and a first source. A silicon (Si) MOSFET has a second gate, a second drain, and a second source. The GaN HEMT and the Si MOSFET are connected in a parallel arrangement so that (i) the first drain and the second drain are electrically connected and (ii) the first source and the second source are electrically connected. The second gate is connected to the gate drive circuit output to receive the gate drive signal. A delay block has an input connected to the gate drive circuit output and an delay block output is configured to produce a delayed gate drive signal for driving the GaN HEMT.

Abstract: A hybrid switch apparatus includes a gate drive circuit producing a gate drive signal, a GaN high electron mobility transistor (HEMT) having a first gate, a first drain, and a first source. A silicon (Si) MOSFET has a second gate, a second drain, and a second source. The GaN HEMT and the Si MOSFET are connected in a parallel arrangement so that (i) the first drain and the second drain are electrically connected and (ii) the first source and the second source are electrically connected. The second gate is connected to the gate drive circuit output to receive the gate drive signal. A delay block has an input connected to the gate drive circuit output and an delay block output is configured to produce a delayed gate drive signal for driving the GaN HEMT.

Abstract: A file or other data unit may be scanned for malicious code by calculating a hash value of a portion of the file or data unit and transmitting the hash value of the portion over a computer network to a remotely located server computer. In the server computer, the hash value of the portion may be compared to hash values of malicious codes. The server computer may send the result of the comparison over the computer network to the client computer. The client computer may send one or more additional hash values of other portions of the file or data unit when the result indicates that the hash value of the portion matches a hash value of malicious code. Otherwise, the client computer may deem the file or data unit to be free of malicious code.

Abstract: An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating

Abstract: An LED driver having one end coupled with an LED module and another end coupled to a ground, being capable of generating a duty current and a duty in response to a dropout voltage across the LED driver in a way that, the duty current will increase and the duty will decrease when the dropout voltage exceeds a first threshold, and the duty current will decrease and the duty will increase when the dropout voltage falls below a second threshold.

Abstract: An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating

Abstract: An LED driver having one end coupled with an LED module and another end coupled to a ground, being capable of generating a duty current and a duty in response to a dropout voltage across the LED driver in a way that, the duty current will increase and the duty will decrease when the dropout voltage exceeds a first threshold, and the duty current will decrease and the duty will increase when the dropout voltage falls below a second threshold.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are electrically connected to the first substrate, the second substrate is disposed between the chips, and the chips and the second substrate are disposed within the metal cap.

Abstract: Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

Abstract: Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

Abstract: Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are electrically connected to the first substrate, the second substrate is disposed between the chips, and the chips and the second substrate are disposed within the metal cap.

Abstract: Embodiments of the present invention relate to an improved die layout for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.