Abstract: In some embodiments, the present application provides an integrated chip (IC). The IC includes a metal-insulator-metal (MIM) device disposed over a substrate. The MIM device includes a plurality of conductive plates that are spaced from one another. The MIM device further includes a first conductive plug structure that is electrically coupled to a first conductive plate and to a third conductive plate of the plurality of conductive plates. A first plurality of insulative segments electrically isolate a second conductive plate and a fourth conductive plate from the first conductive plug structure. The MIM device further includes a second conductive plug structure that is electrically coupled to the second conductive plate and to the fourth conductive plate of the plurality of conductive plates. A second plurality of insulative segments electrically isolate the first conductive plate and the third conductive plate from the second conductive plug structure.

Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.

Abstract: An aerospace wiring harness inspection system comprises a mobile personal computing device; a camera system connected to the mobile personal computing device, a machine learning model running in the mobile personal computing device; and a controller. The machine learning model is trained to detect anomalies in a set of images of a wiring harness in an aerospace vehicle. The controller configured to control the camera system to generate a set of images of the wiring harness; send the set of images of the wiring harness to the machine learning model; and receive a result from the machine learning model indicating whether an anomaly is present in the wiring harness.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a semiconductor substrate having sidewalls that form one or more trenches. The one or more trenches are disposed along opposing sides of a photodiode and vertically extend from an upper surface of the semiconductor substrate to within the semiconductor substrate. A doped region is arranged along the upper surface of the semiconductor substrate and along opposing sides of the photodiode. A first dielectric lines the sidewalls of the semiconductor substrate and the upper surface of the semiconductor substrate. A second dielectric lines sidewalls and an upper surface of the first dielectric. The doped region has a width laterally between a side of the photodiode and a side of the first dielectric. The width of the doped region varies at different heights along the side of the photodiode.

Abstract: A vertical probe card device and a fence-like probe thereof are provided. The fence-like probe has a probe length within a range from 5 mm to 8 mm. The fence-like probe includes a fence-like segment, a connection segment, and a testing segment. The fence-like segment has an elongated shape defining a longitudinal direction, and the fence-like segment has a penetrating slot and a first protrusion. The penetrating slot is formed along the longitudinal direction and has a length greater than 65% of the probe length. The first protrusion extends from one of two long walls of the penetrating slot by a first predetermined width and is spaced apart from another one of the two long walls of the penetrating slot by a first gap. The connection segment and the testing segment are respectively connected to two end portions of the fence-like segment.

Abstract: A computing system including a processor configured to receive a mesh of a three-dimensional geometry. The processor is further configured to receive a source antenna location and a destination antenna location on the mesh. The processor is further configured to compute a ray path as an estimated shortest path between the source antenna location and the destination antenna location. The ray path includes a geodesic path over the mesh and a free space path outside the mesh. The ray path is computed at least in part by computing the geodesic path at least in part by performing inferencing at a trained neural network. Computing the ray path further includes computing the free space path at least in part by performing raytracing from a launch point located at an endpoint of the geodesic path. The processor is further configured to output the ray path to an additional computing process.

Abstract: A cantilever probe card and a probe module thereof are provided. The probe module includes a supporting board, a substrate disposed on the supporting board, a plurality of cantilever probes, and a plurality of fine adjustment members. The substrate has a non-planar shape and has a difference of warpage along a testing direction. One end of each of the cantilever probes is connected to the substrate, and another end of each of the cantilever probes is a free end. The fine adjustment members are spaced apart from each other and are disposed between the supporting board and the substrate. Each of the fine adjustment members is configured to be independently operable along the testing direction for changing a distance between the supporting board and the substrate. The substrate is deformable through at least one of the fine adjustment members so as to reduce the difference of warpage.

Abstract: Provided is a method of fabricating an image sensor device. An exemplary includes forming a plurality of radiation-sensing regions in a substrate. The substrate has a front surface, a back surface, and a sidewall that extends from the front surface to the back surface. The exemplary method further includes forming an interconnect structure over the front surface of the substrate, removing a portion of the substrate to expose a metal interconnect layer of the interconnect structure, and forming a bonding pad on the interconnect structure in a manner so that the bonding pad is electrically coupled to the exposed metal interconnect layer and separated from the sidewall of the substrate.

Abstract: A semiconductor structure includes a semiconductor substrate, an interconnection structure, a color filter, and a first isolation structure. The semiconductor substrate includes a first surface and a second surface opposite to the first surface. The interconnection structure is disposed over the first surface, and the color filter is disposed over the second surface. The first isolation structure includes a bottom portion, an upper portion and a diffusion barrier layer surrounding a sidewall of the upper portion. A top surface of the upper portion of the first isolation structure extends into and is in contact with a dielectric layer of the interconnection structure.

Abstract: A light absorption probe includes an arm segment, a main segment located at one side of the arm segment, a testing segment connected to another side of the arm segment, and a light absorption coating layer. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction and includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment. The light absorption coating layer covers the upright portion, and the pinpoint portion is exposed from the light absorption coating layer. Through the light absorption coating layer, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus.

Abstract: A micro electro mechanical system (MEMS) probe includes an arm segment, a main segment, and a testing segment. The main segment is arranged at one side of the arm segment, the main segment defines a layout region arranged inside of an outer contour thereof, and the main segment has a soldering end portion and an extending end portion respectively arranged at two opposite sides of the distribution region along a predetermined direction. The testing segment has an upright shape along the predetermined direction and is connected to another side of the arm segment. The layout region has a plurality of thru-holes that occupy 3% to 70% of a region surroundingly defined by the outer contour. The layout region is spaced apart from the outer contour by a layout spacing that is less than or equal to an inner diameter of any one of the thru-holes.

Abstract: A cantilever probe module includes a plurality of first probes and a plurality of second probes. Each of the first probes includes a first arm segment, a first main segment, and a first testing segment, the latter two of which are respectively connected to two ends of the first arm segment. Each of the second probes includes a second arm segment, an extending segment and a second testing segment both respectively connected to two ends of the second arm segment, and a second main segment that is connected to the extending segment. A height of the extending segment is 5% to 50% of a height of the second main segment. When the first main segments of the first probes and the second main segments of the second probes are staggeredly fixed onto a substrate, the first testing segments and the second testing segments are arranged in one row.

Abstract: A solder receiving probe includes an arm segment, a main segment located at one side of the arm segment, and a testing segment connected to another side of the arm segment. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The main segment has a plurality of solder receiving holes that are arranged along a top edge of the soldering end portion and that are arranged in one row along an extending direction perpendicular to the predetermined direction. Any two of the solder receiving holes adjacent to each other are provided with one inner supporting arm therebetween. Each of the solder receiving holes can receive a solder, so that the solder does not climb across the solder receiving holes of the one row along the predetermined direction.

Abstract: A light scattering probe includes an arm segment, a main segment located at one side of the arm segment, and a testing segment connected to another side of the arm segment. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction and includes a pinpoint portion and an upright portion that connects the pinpoint portion and the arm segment. The upright portion has a roughened surface arranged on an entirety of an outer surface thereof. The roughened surface has an arithmetic average roughness (Ra) within a range from 0.1 ?m to 1 ?m. Through the roughened surface, the testing segment only forms an observation point at the pinpoint portion in an observation process of a detection apparatus.

Abstract: A climb-restricting probe includes an arm segment, a main segment located at one side of the arm segment, a testing segment connected to another side of the arm segment, and a climb-restricting ring. The main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction. The testing segment has an upright shape along the predetermined direction. The climb-restricting ring surrounds the main segment along a top edge of the soldering end portion and protrudes from an outer surface of the main segment. The climb-restricting ring has a restriction height along the predetermined direction. The restriction height is within a range from 3 ?m to 50 ?m. The climb-restricting ring can block a solder from climbing past the climb-restricting ring along the predetermined direction.

Abstract: A vertical probe card having different probes is provided, and includes a first guiding board unit, a second guiding board unit, and a plurality of fence-like probes passing through the first and the second guiding board units. Each of the fence-like probes has a probe length within a range from 5 mm to 8 mm, and includes a fence-like segment, a connection segment, and a testing segment. The fence-like segment includes a penetrating slot having a length greater than 65% of the probe length. The fence-like segment includes two arms respectively arranged at two opposite sides of the penetrating slot and spaced apart from each other by an adjustment distance within a range from 10 ?m to 120 ?m. The fence-like probes include a first probe and a second probe, which have a same contact force and are configured to respectively meet different electrical transmission requirements.

Abstract: A method includes performing an anisotropic etching on a semiconductor substrate to form a trench. The trench has vertical sidewalls and a rounded bottom connected to the vertical sidewalls. A damage removal step is performed to remove a surface layer of the semiconductor substrate, with the surface layer exposed to the trench. The rounded bottom of the trench is etched to form a slant straight bottom surface. The trench is filled to form a trench isolation region in the trench.

Abstract: A health care device illustrated has a low-frequency wave emitter, a low-frequency waveguide and a plant essential oil carrier disposed between the low-frequency wave emitter and the low-frequency waveguide. The low-frequency wave emitter emits a low-frequency wave with a predetermined frequency, and the low-frequency wave firstly passes through the plant essential oil carrier, and then propagates to the low-frequency waveguide. Next, energy of the low-frequency wave is focused in the low-frequency waveguide, and then the low-frequency wave is emitted out from the low-frequency waveguide. A health care method illustrated emits the low-frequency wave with the predetermined frequency to a belly button of a user by using the health care device. The health care device and method increase contents of NAD+ in blood of the user, and achieve effects of convenient operation, accurate use position identification, and non-invasive and non-contact health care.

Abstract: A modular vertical probe card having different probes is provided, and includes a first guiding board unit, a second guiding board unit, and a plurality of conductive probes that pass through the first and the second guiding board units. The conductive probes have a same probe length. Each of the conductive probes includes a stroke segment located between the first guiding board unit and the second guiding board unit, a connection segment, and a testing segment, the latter two of which are respectively connected to two ends of the stroke segment. The stroke segments of the conductive probes have N number of shapes different from each other to allow the conductive probes to have a same contact force and to be configured to meet N number of electrical transmission requirements different from each other, in which N is a positive integer greater than one.

Abstract: A cantilever probe card device and an elastic probe thereof are provided. The elastic probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. Moreover, one of the two outer elastic arms adjacent to the needle tip is defined as a first outer elastic arm, and another one of the two outer elastic arms is defined as a second outer elastic arm. Specifically, a length of the first outer elastic arm is greater than a length of the second outer elastic arm.