Patents by Inventor Hui-Tzu Wang

Hui-Tzu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240073660
    Abstract: A positioning system and a positioning method based on radio frequency identification techniques (RFID) are provided. The positioning system includes in-vehicle devices, RFID readers and a server. The in-vehicle devices each includes a positioning device, an image capturing device and an image recognition module. The positioning device obtains a positioning location. The image capturing device captures a driving image. The image recognition module identifies adjacent vehicles, adjacent license plate information, and road attributes, and calculates relative location information. Each of the RFID readers reads a vehicle tag of one of the vehicles passing by, so as to mark a reference vehicle and generate reference vehicle information. A positioning adjustment module of the server determines whether the target vehicle is a reference vehicle, has been the reference vehicle or is a non-reference vehicle, and adjusts the positioning location of the target vehicle in different ways, accordingly.
    Type: Application
    Filed: October 11, 2022
    Publication date: February 29, 2024
    Inventors: YAO-SHUN YANG, HUI-TZU HUANG, JIAN-YING CHEN, CHUAN-CHUAN WANG
  • Publication number: 20230307302
    Abstract: A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 28, 2023
    Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS PTE LTD
    Inventors: David GANI, Hui-Tzu Wang