Patents by Inventor Hui Wei

Hui Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149207
    Abstract: A large-tonnage disc-shaped suspension ceramic insulator includes a ceramic insulator body, and a metal pin and a metal cap coaxially assembled with the ceramic insulator body through adhesive material, assembly interfaces of the ceramic insulator body, the metal cap, and the metal pin are coated with a primer; the adhesive material includes an expansion agent; and the expansion agent is configured to make the adhesive material expand after hardening so as to create a prestress between the ceramic insulator body and the metal pin as well as the metal cap. The present disclosure achieves overall compressive prestress distribution of the ceramic insulator product, mitigating thermal stress caused by temperature changes and improving the tensile strength of the large-tonnage disc-shaped suspension ceramic insulator assembly. By treating the assembly interfaces with the primer, the present disclosure significantly improves the assembly strength of the ceramic insulator/metal assembly.
    Type: Application
    Filed: January 12, 2025
    Publication date: May 8, 2025
    Applicants: CHAOHU UNIVERSITY, PINGXIANG BEST INSULATOR GROUP CO., LTD
    Inventors: Xiaoyong XU, Jiasheng LIU, Hui WEI, Fenping CHEN, Lin XU, Linmin XU, Zhiying ZHOU, Jianguo DENG, Minghua LIU
  • Publication number: 20250139785
    Abstract: A system and method of generating training results using a vision system is provided. At least one training image is selected, in which the image includes at least one representative feature. A line-finding tool searches the at least one training image for the at least one representative feature using at least one caliper, and a projection signal is generated from projection data associated with the at least one caliper. A filter signal is generated from the projection signal. An index value is generated by finding an edge of the at least one caliper nearest to an expected feature.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 1, 2025
    Inventors: Qian Wang, Jia-Hui Wei, Yong Li, Qian-Feng Fan
  • Publication number: 20250136400
    Abstract: The present application discloses a winding method and a winding system, and relates to the technical field of battery fabrication. The winding method includes: obtaining a first parameter and a second parameter of each electrode assembly on a winding needle in real time, the first parameter being any one of a number of winding layers, a sheet length and a winding roll diameter, and the second parameter being one or both of the remaining two of the number of winding layers, the sheet length and the winding roll diameter; comparing the second parameters respectively with corresponding preset parameter ranges, the preset parameter ranges being the ranges of the second parameters corresponding to the first parameters of preset standard models corresponding to the electrode assemblies; and adjusting, in response to the second parameter exceeding the corresponding preset parameter range, sheets to be wound of the corresponding electrode assembly.
    Type: Application
    Filed: January 3, 2025
    Publication date: May 1, 2025
    Inventors: Xiaowei Zhang, Hui Wei, Xiang Wu, Guoda Huang, Yuqian Wen, Minghao Tang, Shengwu Zhang
  • Publication number: 20250112087
    Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 3, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hwei-Jay CHU, Hsi-Wen TIEN, Wei-Hao LIAO, Yu-Teng DAI, Hsin-Chieh YAO, Tzu-Hui WEI, Chih Wei LU, Chan-Yu LIAO, Li-Ling SU, Chia-Wei SU, Yung-Hsu WU, Hsin-Ping CHEN
  • Publication number: 20250105057
    Abstract: An interconnect structure includes a first conductive feature, a first dielectric layer a first etch stop layer, a second etch stop layer, a second dielectric layer, and a second conductive feature. The first etch stop layer is disposed over the first conductive feature and the first dielectric layer. The second etch stop layer is disposed on the first etch stop layer. The second dielectric layer is disposed on the second etch stop layer. The second conductive feature includes a first conductive layer and a first barrier layer. The first conductive layer extends through the second dielectric layer, the second and the first etch stop layers to contact to the first conductive feature. The first barrier layer is sandwiched between the first conductive layer and the second dielectric layer, the first conductive layer and the second etch stop layer, and between the first conductive layer and the first etch stop layer.
    Type: Application
    Filed: September 22, 2023
    Publication date: March 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shao-Kuan Lee, Tzu-Hui Wei, Cheng-Hsiung Tsai, Chieh-Han Wu, Yu-Hao Yeh
  • Publication number: 20250073955
    Abstract: The present disclosure provides an under-wire spray cleaning device for a wire cutting machine including: a spray assembly connected to a trough body, wherein the trough body is entirely disposed in an engaging slot of a nozzle pipe device; wherein the spray assembly includes first nozzles disposed on an inside of the trough body and second nozzles disposed on an outside of the trough body, the first nozzles are configured to clean a feed machine and a clamping mushroom head, and the second nozzles are configured to clean a sheave of the outside of the trough body. An advantage of the present disclosure is changing manually cleaning to cleaning by a spray device, which drastically improves cleaning efficiency and also prevents influence of human factors to cleanliness of the machine.
    Type: Application
    Filed: July 31, 2023
    Publication date: March 6, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Yannan LI, Pengfan BI, Chuanling AI, Yi SUN, Shaohua FU, Yue ZHANG, Hongxia CEN, Chao XIN, Hui WEI
  • Publication number: 20250054238
    Abstract: A method and apparatus for reconstructing semantic instance, a device and medium, which relate to the field of three-dimensional vision. The method comprises: processing an original image by using a first target detection network to obtain first feature information of a target object, and processing a three-dimensional point cloud by using a second target detection network to obtain second feature information; predicting a first coarse point cloud on the basis of the first feature information, and predicting a three-dimensional detection result on the basis of the first feature information and the second feature information, so as to obtain a second coarse point cloud; and obtaining an initial point cloud of the target object on the basis of the first coarse point cloud and the second coarse point cloud, and processing the initial point cloud by using preset shape generation network to obtain semantic instance reconstruction result of the target object.
    Type: Application
    Filed: February 28, 2023
    Publication date: February 13, 2025
    Applicant: SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Lihua LU, Hui WEI, Ruyang LI, Yaqian ZHAO, Rengang LI
  • Patent number: 12211700
    Abstract: An example embodiment of the present disclosure involves a method for semiconductor device fabrication. The method comprises providing a structure that includes a conductive component and an interlayer dielectric (ILD) that includes silicon and surrounds the conductive component, and forming, over the conductive component and the ILD, an etch stop layer (ESL) that includes metal oxide. The ESL includes a first portion in contact with the conductive component and a second portion in contact with the ILD. The method further comprises baking the ESL to transform the metal oxide located in the second portion of the ESL into metal silicon oxide, and selectively etching the ESL so as to remove the first portion of the ESL but not the second portion of the ESL.
    Type: Grant
    Filed: May 26, 2023
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Hua Huang, Tzu-Hui Wei, Cherng-Shiaw Tsai
  • Publication number: 20250026120
    Abstract: A glue application head for bonding is provided, including a main body. The main body includes a cavity for storing glue and a slit for applying the glue. Through the slit, the glue in the cavity is discharged from the glue application head to be applied on a workpiece to form a glue path with a predetermined line width. Not only can a glue layer with a uniform thickness be obtained, but also a problem of no glue coming out can be prevented. Accordingly, the glue application head has improved performance in coating the glue on the workpiece, and bonding ability of the glue can also be improved. A gluing mechanism with the glue application head and a bonding equipment including the gluing mechanism are also provided. A good fit is provided between the glue application head and the workpiece to prevent no dispensing and an overflow of the glue.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 23, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Pengfan BI, Yannan LI, Chuanling AI, Yi SUN, Shaohua FU, Yue ZHANG, Hongxia CEN, Chao XIN, Hui WEI
  • Publication number: 20240316161
    Abstract: The present invention relates to fibronectin-based scaffold domain proteins that bind to myostatin. The invention also relates to the use of these proteins in therapeutic applications to treat muscular dystrophy, cachexia, sarcopenia, osteoarthritis, osteoporosis, diabetes, obesity, COPD, chronic kidney disease, heart failure, myocardial infarction, and fibrosis. The invention further relates to cells comprising such proteins, polynucleotides encoding such proteins or fragments thereof, and to vectors comprising the polynucleotides encoding the proteins.
    Type: Application
    Filed: October 6, 2023
    Publication date: September 26, 2024
    Inventors: Sharon CLOAD, Linda ENGLE, Dasa LIPOVSEK, Malavi MADIREDDI, Ginger Chao RAKESTRAW, Joanna SWAIN, Wenjun ZHAO, Hui WEI, Aaron P. YAMNIUK, Vidhyashankar RAMAMURTHY, Alexander T. KOZHICH, Martin J. CORBETT, Stanley Richard KRYSTEK, JR.
  • Patent number: 12062223
    Abstract: A high-resolution image matching method and system are provided. The method includes performing regional fidelity down-sampling on an initial high-resolution image to obtain a multi-level low-resolution image, performing local matching on the obtained multi-level low-resolution images using a method with global probes to obtain a matching result of the low-resolution images, and performing reverse refinement on the obtained matching result of the low-resolution image using overall consistency of the image matching, to obtain the matching results of the high-resolution images at all levels until the matching results of the initial resolution images are obtained, so as to reduce the computational complexity of the image matching process and improve the accuracy of the matching result, and then the matching result of the high-resolution image is obtained through reverse refinement based on the overall consistency.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 13, 2024
    Assignee: INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Hui Wei, Xiaomin Zhu, Yaqian Zhao, Rengang Li
  • Patent number: 12044780
    Abstract: A sensing system is designed to include a plurality of linear sensors, where these linear sensors are spaced apart, positioned or disposed in parallel on a substrate. These sensors are provided to detect respective distances towards a target from different planes so as to generate a plurality of 2D maps. A thin or coarse 3D map is then generated from these 2D maps to facilitate movements of a mobile robot employing the sensing system.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: July 23, 2024
    Assignee: CMOS Sensor, Inc.
    Inventor: Hui Wei
  • Publication number: 20240229005
    Abstract: Disclosed herein are compositions and methods for making and using improved carbonic anhydrases for novel, sustainable, and low energy CO2 waste gas scrubbing technologies that are also transformational carbon capture technologies. Embodiments of methods, systems and compositions disclosed herein include, but are not limited to, non-aqueous solvents, advanced membranes, sorbents, and cryogenic systems that significantly reduce the cost of CO2 capture from coal and natural gas-fired power plants and industrial facilities. Methods disclosed herein reduce the energy and cost required for CO2 separation and can be applied for both pre-combustion and post-combustion CO2 capture.
    Type: Application
    Filed: February 22, 2022
    Publication date: July 11, 2024
    Inventors: Min ZHANG, Vladimir Vladimirovich LUNIN, Hui WEI
  • Publication number: 20240132869
    Abstract: Disclosed herein are compositions and methods for making and using improved carbonic anhydrases for novel, sustainable, and low energy CO2 waste gas scrubbing technologies that are also transformational carbon capture technologies. Embodiments of methods, systems and compositions disclosed herein include, but are not limited to, non-aqueous solvents, advanced membranes, sorbents, and cryogenic systems that significantly reduce the cost of CO2 capture from coal and natural gas-fired power plants and industrial facilities. Methods disclosed herein reduce the energy and cost required for CO2 separation and can be applied for both pre-combustion and post-combustion CO2 capture.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 25, 2024
    Inventors: Min ZHANG, Vladimir Vladimirovich LUNIN, Hui WEI
  • Patent number: 11960008
    Abstract: Techniques of designing a sensing system for pseudo 3D mapping in robotic applications are described. According to one aspect of the present invention, an image system is designed to include at least two linear sensors, where these two linear sensors are positioned or disposed orthogonally. In one embodiment, the two linear sensors are a horizontal sensor and a vertical sensor. The horizontal sensor is used for the lidar application while the vertical sensor is provided to take videos, namely scanning the environment wherever the horizontal sensor misses. As a result, the videos can be analyzed to detect anything below or above a blind height in conjunction with the detected distance by the lidar.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: April 16, 2024
    Assignee: CMOS Sensor, Inc.
    Inventors: Weng Lyang Wang, Hui Wei
  • Publication number: 20240005595
    Abstract: A three-dimensional reconstruction method, a system, and a non-transitory computer readable storage medium are disclosed herein. The method includes: performing local pose optimization by using a target image frame to obtain a local pose error; performing neural network prediction on the target image frame to obtain an initial reconstruction error; performing three-dimensional reconstruction according to the local pose error and the initial reconstruction error to obtain an initial reconstruction model; performing global pose optimization by using historical image frames to obtain a global optimization result and a global pose error; performing neural network completion on the global optimization result to obtain a final reconstruction error; and optimizing the initial reconstruction model according to the global pose error and the final reconstruction error to obtain a final reconstruction model.
    Type: Application
    Filed: January 28, 2022
    Publication date: January 4, 2024
    Inventors: Hui Wei, Ruyang Li, Yaqian Zhao, Rengang Li
  • Patent number: 11830910
    Abstract: A method for manufacturing a semiconductor structure includes forming a trench in a dielectric structure; forming a spacer layer on a lateral surface of the dielectric structure exposed by the trench; after forming the spacer layer, forming a first electrically conductive feature in the trench; removing at least portion of the dielectric structure to form a recess; forming an etch stop layer in the recess and over the first electrically conductive feature; and after forming the etch stop layer, depositing a dielectric layer in the recess and over the first electrically conductive feature.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: November 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Han Wu, Hwei-Jay Chu, An-Dih Yu, Tzu-Hui Wei, Cheng-Hsiung Tsai, Chung-Ju Lee, Shin-Yi Yang, Ming-Han Lee
  • Publication number: 20230378255
    Abstract: A method for manufacturing a semiconductor structure includes forming a trench in a dielectric structure; forming a spacer layer on a lateral surface of the dielectric structure exposed by the trench; after forming the spacer layer, forming a first electrically conductive feature in the trench; removing at least portion of the dielectric structure to form a recess; forming an etch stop layer in the recess and over the first electrically conductive feature; and after forming the etch stop layer, depositing a dielectric layer in the recess and over the first electrically conductive feature.
    Type: Application
    Filed: August 2, 2023
    Publication date: November 23, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Han WU, Hwei-Jay CHU, An-Dih YU, Tzu-Hui WEI, Cheng-Hsiung TSAI, Chung-Ju LEE, Shin-Yi YANG, Ming-Han LEE
  • Publication number: 20230365163
    Abstract: An automatic driving method includes following steps: S101: acquiring real-time traffic environment information in a travel process of an autonomous vehicle at a current moment; S102: mapping the real-time traffic environment information based on a preset mapping relationship to obtain mapped traffic environment information; S103: adjusting a target deep reinforcement learning model based on a pre-stored existing deep reinforcement learning model and the mapped traffic environment information; and S104: judging whether automatic driving is finished, and in response to the automatic driving is not finished, returning to perform the step of acquiring the real-time traffic environment information in the travel process of the autonomous vehicle at the current moment. An automatic driving system, an automatic driving device and a computer medium storing the automatic driving method are further provided.
    Type: Application
    Filed: July 29, 2021
    Publication date: November 16, 2023
    Inventors: Ruyang LI, Rengang LI, Yaqian ZHAO, Xuelei LI, Hui WEI, Zhe XU, Yaqiang ZHANG
  • Patent number: 11813315
    Abstract: The present invention relates to fibronectin-based scaffold domain proteins that bind to myostatin. The invention also relates to the use of these proteins in therapeutic applications to treat muscular dystrophy, cachexia, sarcopenia, osteoarthritis, osteoporosis, diabetes, obesity, COPD, chronic kidney disease, heart failure, myocardial infarction, and fibrosis. The invention further relates to cells comprising such proteins, polynucleotides encoding such proteins or fragments thereof, and to vectors comprising the polynucleotides encoding the proteins.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: November 14, 2023
    Assignee: Bristol-Myers Squibb Company
    Inventors: Sharon Cload, Linda Engle, Dasa Lipovsek, Malavi Madireddi, Ginger Chao Rakestraw, Joanna Swain, Wenjun Zhao, Hui Wei, Aaron P. Yamniuk, Vidhyashankar Ramamurthy, Alexander T. Kozhich, Martin J. Corbett, Stanley Richard Krystek, Jr.