Patents by Inventor Hui-Wen Hsu

Hui-Wen Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protective device and protective module
    Patent number: 9025295
    Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: May 5, 2015
    Assignee: Cyntec Co., Ltd.
    Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Lang-Yi Chiang, Wen-Shiang Luo, Kuo-Shu Chen, Han-Yang Chung, Hui-Wen Hsu, Po-Wei Su, Hong-Ming Chen
  • PROTECTIVE DEVICE AND PROTECTIVE MODULE
    Publication number: 20140133059
    Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.
    Type: Application
    Filed: January 23, 2014
    Publication date: May 15, 2014
    Applicant: CYNTEC CO., LTD.
    Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Lang-Yi CHIANG, Wen-Shiang LUO, Kuo-Shu CHEN, Han-Yang CHUNG, Hui-Wen HSU, Po-Wei SU, Hong-Ming CHEN
  • Phosphor composition for AC LEDS and AC LED manufactured with the same
    Publication number: 20120013243
    Abstract: The present invention provides a phosphor composition for AC LEDs, which is represented by the following formula (I): M1?x?ySi2O2?wN2+2w/3:Eux,Ry??(I) wherein, M, R, x, y, and w are defined the same as the specification. In addition, the present invention also provides an AC LED manufactured with the same.
    Type: Application
    Filed: September 8, 2010
    Publication date: January 19, 2012
    Applicant: Forward Electronics Co., Ltd
    Inventors: Ru-Shi Liu, Chiao-Wen Yeh, Hui-Wen Hsu, Wen-Hsiung Li, Jung-Chien Chang, Yu-Bing Lan
  • Packaging Structure of AC light-emitting diodes
    Publication number: 20110089443
    Abstract: A packaging structure of AC LEDs is provided, which comprises: a carrier containing a positive electrode connecting end, and a negative electrode connecting end; an AC LED module disposed on the carrier, wherein the AC LED module electrically connects to the positive electrode connecting end and the negative electrode connecting end of the carrier; and a die-bonding insulating layer disposed between the AC LED module and the carrier.
    Type: Application
    Filed: June 22, 2010
    Publication date: April 21, 2011
    Applicant: Forward Electronics Co., Ltd.
    Inventor: Hui-Wen Hsu