Patents by Inventor Hui-Wen TING

Hui-Wen TING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190270179
    Abstract: A method including rotating a plate of a pad conditioner about an axis parallel to an axis of rotation of a planarization pad of a planarization device. The method further includes dispensing a fluid material onto an upper surface of the planarization pad through a nozzle opening of the pad conditioner during a planarization process, wherein the fluid material comprises an acid. The method further includes maintaining the pad conditioner at a position spaced from the upper surface of the planarization pad during the dispensing of the fluid material and the rotating of the plate.
    Type: Application
    Filed: May 20, 2019
    Publication date: September 5, 2019
    Inventor: Hui-Wen TING
  • Patent number: 10293462
    Abstract: A planarization device includes a planarization pad and a pad conditioner over the planarization pad. The pad conditioner includes a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance and at least one nozzle opening on the lower surface of the rotatable plate.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: May 21, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Hui-Wen Ting
  • Publication number: 20150031273
    Abstract: A planarization device includes a planarization pad and a pad conditioner over the planarization pad. The pad conditioner includes a rotatable plate having a lower surface separated from an upper surface of the planarization pad by a predetermined distance and at least one nozzle opening on the lower surface of the rotatable plate.
    Type: Application
    Filed: July 23, 2013
    Publication date: January 29, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Hui-Wen TING