Abstract: A wafer cleaning apparatus includes a rinsing container in which wafers to be cleaned are positioned and four sets of nozzles arranged in the rinsing container to be symmetric with respect to each other. The nozzles generate water jets toward the wafers for performing a wafer cleaning process. In a first phase of the wafer cleaning process, the first nozzle set and the fourth nozzle set are turned on to generate water jets in diagonally opposite directions with respect to the wafers for a given period. In a second phase, the second nozzle set and the third nozzle set are turned on to generate water jets in diagonally opposite directions with respect to the wafers for a given period. In a third phase, the third nozzle set and the fourth nozzle set are turned on to cause an up-rising water flow from a bottom of the container to a top open side thereof for expelling contaminants dissolved or suspended in the water out of the container.