Abstract: Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. The first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. The first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. The first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a base layer, a dielectric interposer coupled to the base layer and including a first outer surface facing the base layer and an opposing second outer surface facing away from the base layer and spaced apart from the first outer surface in a direction, a first electrical-connection cut-in in the second outer surface that extends, in the direction, toward the first outer surface, and one or more first electrical connections disposed within the first electrical-connection cut-in such that at least a portion of the one or more first electrical connections does not extend, in the direction, beyond the second outer surface.

Abstract: Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. A controller die with a first longitudinal footprint can be attached to the front side of the package substrate. A passive electrical component is also attached to the front side of the package substrate. A stack of semiconductor dies can be attached to the controller die and the passive electrical component. The stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. The controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.

Abstract: A semiconductor package includes a lead frame, a low side field-effect transistor (FET), a high side FET, a metal clip, and a molding encapsulation. The low side FET is flipped and is attached to a first die paddle of the lead frame. The lead frame comprises one or more voltage input (Vin) leads; a gate lead; one or more switching node (Lx) leads; a first die paddle; a second die paddle; and an end paddle. Each of an exposed bottom surface of the one or more Lx leads is directly connected to an exposed bottom surface of the end paddle. A longitudinal direction of an exposed bottom surface of the gate lead is perpendicular to a longitudinal direction of each of the exposed bottom surface of the one or more Lx leads. An entirely of each of the one or more Vin leads is of the full thickness.

Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.

Abstract: This document discloses techniques, apparatuses, and systems relating to a package substrate for a semiconductor device. A semiconductor device assembly is described that includes a packaged semiconductor device having one or more semiconductor dies coupled to a package-level substrate. The package-level substrate has a first surface at which first contact pads are disposed in a first configuration. The packaged semiconductor device is coupled with an additional package-level substrate that includes a second surface having second contact pads disposed in the first configuration and a third surface having third contact pads disposed in a second configuration different from the first configuration. The additional package-level substrate includes circuitry coupling the second contact pads the third contact pads to provide connectivity at the third contact pads. In doing so, an adaptively compatible semiconductor device may be assembled.

Abstract: Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.

Abstract: Methods, systems, and devices for multi-chip package with enhanced conductive layer adhesion are described. In some examples, a conductive layer (e.g., a conductive trace) may be formed above a substrate. An integrated circuit may be bonded to the conductive layer and an encapsulant may be deposited at least between the integrated circuit and the conductive layer. In some examples, one or more surface features or one or more recesses may be formed on or within the conductive layer and the encapsulant may adhere to the surface features or recesses.

Abstract: Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper module package includes a second substrate and one or more second electronic devices mounted on a first side of the second substrate. The second substrate includes a cavity at a second side of the second substrate opposite the first side, and the upper module package is mountable on the first side of the first substrate of the main module package such that the first electronic device is positioned within the cavity and the second substrate generally surrounds at least a portion of a perimeter of the first electronic device.

Abstract: A rechargeable lithium-ion battery includes a positive electrode enabling fast charging. A negative electrode has a first active material including Li4Ti5O12. A positive electrode includes a second active material including LiCoO2. The positive electrode further includes a carbon conductive agent and a binder. A weight ratio of the carbon conductive agent to the binder is in a range of about 2:3 to about 3:2.

Abstract: A vibration isolation/damping satellite mount of a chopped carbon fiber reinforced thermoplastic composite material mainly includes two parts, and the two parts are connected through bolts. Considering the limitation of the molding process, the mount configuration is further optimized, and the mount structure is prepared by using the injection molding process. Furthermore, the vibration isolation/damping satellite mount of the chopped carbon fiber reinforced thermoplastic composite material prepared in the present invention can be used for large loads and complex working conditions, and the connectivity, overall strength stability, vibration isolation performance and service life of the mount all meet the design requirements.

Abstract: One or more devices, systems, methods and/or non-transitory, machine-readable mediums are described herein for specifying one or more events in an augmented reality (AR) environment relative to a real-world (RW) environment. A system can comprise a memory that stores executable components, and a processor, coupled to the memory, that executes or facilitates execution of the executable components. The executable components can comprise a visual component that analyzes captured visual content of a RW environment, an interface component that integrates the visual content of the RW environment with AR content of an AR environment overlaying the RW environment, and a design component that facilitates in-situ placement of the AR content in the AR environment based on the visual content being overlayed, wherein the AR content comprises a specification of an event to be executed in the RW environment that triggers a virtual asset in the AR environment.

Abstract: Embodiments of the present disclosure relate to methods, devices and apparatuses for optical communication, and a computer readable medium. An embodiment of the method comprises determining, at an optical line terminal, a channel characteristic of a channel from an optical network unit to the optical line terminal; determining, based on the channel characteristic, a preamble property for a transmission from the optical network unit to the optical line terminal, the preamble property at least partially compensating for transmission distortion caused by the channel characteristic; transmitting preamble information to the optical network unit, the preamble information being for generating a preamble having the preamble property; and receiving the preamble having the preamble property from the optical network unit. In this way, a training speed of an equalizer of the optical line terminal can be improved, and preamble overhead can be reduced.

Abstract: Examples of the present disclosure relate to a method, device and apparatus for communication, and a computer-readable medium. An example of the method includes: conducting, based on a channel response between a transmitter and a receiver, spectral shaping on a first sequence at the transmitter, so as to obtain an intermediate sequence, where the spectral shaping at least partially counters the channel response; remapping the intermediate sequence, so as to obtain a second sequence, where the second sequence has less signal levels than the intermediate sequence; and transmitting the second sequence to the receiver, so as to train an equalizer of the receiver. In this way, the method can accelerate training of the equalizer without sacrificing performance of the equalizer or introducing any additional hardware cost.

Abstract: Embodiments of the present disclosure belongs to the technical field of animal feed and provides a method for rapidly evaluating metabolizable energy of goose diet by using a technique of simulative digestion gross energy. By using the technical means combining the biological method and the simulative digestion gross energy technique, metabolizable energy of goose feed can be evaluated quickly. Based on the “stomach-small intestine” two-step enzymatic methods, it is the first time to establish a regression equation between the metabolizable energy change and fiber level in the cecum to rectify the value of simulative digestion gross energy in the cecal microbial digestion phase, making the simulative digestion gross energy technique more reasonable in the assessment of metabolizable energy in geese. Results show that the use of simulative digestion gross energy technique to assess the metabolizable energy of goose feed value is highly feasible.

Abstract: An electronic driver for transforming an electronic ballast input voltage into an operating voltage for an LED lighting module. The driver includes a flicker eliminating circuit, which is adapted to operate in a saturation mode when the input voltage is below a threshold voltage. It operates in a switch mode when the input voltage is above a threshold voltage. A voltage drop in the flicker eliminating circuit in the saturation mode is higher than in the switch mode.

Abstract: A vibration isolation/damping satellite mount of a chopped carbon fiber reinforced thermoplastic composite material mainly includes two parts, and the two parts are connected through bolts. Considering the limitation of the molding process, the mount configuration is further optimized, and the mount structure is prepared by using the injection molding process. Furthermore, the vibration isolation/damping satellite mount of the chopped carbon fiber reinforced thermoplastic composite material prepared in the present invention can be used for large loads and complex working conditions, and the connectivity, overall strength stability, vibration isolation performance and service life of the mount all meet the design requirements.

Abstract: An electrochemical cell includes an anode, a cathode, a separator, and a liquid electrolyte. The cathode includes an active material, a conductive material, a binder, and a gelling powder. The separator is arranged between the anode and the cathode. The separator is configured to prevent direct contact between the anode and the cathode. The liquid electrolyte transports positively charged ions between the cathode and the anode.