Abstract: An artificial leather is provided in some embodiments of the present disclosure, including: an artificial bio-nutritional fiber layer and a mycelium layer. The artificial bio-nutritional fiber layer includes a first surface, a second surface opposite to the first surface and a plurality of holes, in which the plurality of holes extends from the first surface to the second surface. The mycelium layer encapsulates the first surface and the second surface of the artificial bio-nutritional fiber layer, and extends from the first surface to the second surface through the plurality of holes. A manufacture method of an artificial leather is further provided in some embodiments of the present disclosure.

Abstract: A method of providing an input method for an electronic device includes receiving a command for switching a display image of the electronic device; determining whether at least two words correspond to at least two languages when at least the two words are in the display image; determining a word count of a first language and a word count of a second language when the two words correspond to the two languages; and enabling a first input method corresponding to the first language when the word count of the first language is greater than the word count of the second language, or enabling a second input method corresponding to the second language when the word count of the second language is greater than the word count of the first language.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A method of providing an input method for an electronic device includes receiving a command for switching a display image of the electronic device; determining whether at least two words correspond to at least two languages when at least the two words are in the display determining a word count of a first language and a word count of a second language when the two words correspond to the two languages; and enabling a first input method corresponding to the first language when the word count of the first language is greater than the word count of the second language, or enabling a second input method corresponding to the second language when the word count of the second language is greater than the word count of the first language.

Abstract: A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Abstract: A printed circuit board is disclosed. The printed circuit board includes a solder mask area and at least one chip attachment area. The at least one chip attachment area has an isolation solder mask layer such that the chip attachment area forms a plurality of chip sub-attachment areas to reduce an area of a solder paste smeared on the chip attachment area, and the isolation solder mask layer has at least one hole.