Patents by Inventor Hui-Ying Kuo

Hui-Ying Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alternating current light emitting diode device
    Patent number: 8174196
    Abstract: An alternating light diode device is provided and includes a substrate, a rectifier and a light emitting diode. The rectifier, a bridge rectifier with four diodes, includes a first alternating terminal and a second alternating terminal receiving an alternating signal and a first electrode and a second electrode outputting a rectified signal. The light emitting diode is electrically connected with the first electrode and the second electrode. Furthermore, the rectifier and the light emitting diode are mounted on the hexagonal star-shaped aluminum substrate wherein the rectifier is arranged around the substrate.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: May 8, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Ying-Chu Lin, Hui-Ying Kuo
  • Circuit board with cooling function
    Patent number: 7808786
    Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: October 5, 2010
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chi-Hao Liang, Xie-Zhi Zhong, Hui-Ying Kuo
  • CIRCUIT BOARD WITH COOLING FUNCTION
    Publication number: 20090219699
    Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
    Type: Application
    Filed: May 13, 2009
    Publication date: September 3, 2009
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: CHI-HAO LIANG, XIE-ZHI ZHONG, HUI-YING KUO
  • ALTERNATING LIGHT EMITTING DIODE DEVICE
    Publication number: 20080169766
    Abstract: An alternating light diode device is provided and includes a substrate, a rectifier and a light emitting diode. The rectifier, a bridge rectifier with four diodes, includes a first alternating terminal and a second alternating terminal receiving an alternating signal and a first electrode and a second electrode outputting a rectified signal. The light emitting diode is electrically connected with the first electrode and the second electrode. Furthermore, the rectifier and the light emitting diode are mounted on the hexagonal star-shaped aluminum substrate wherein the rectifier is arranged around the substrate.
    Type: Application
    Filed: January 25, 2007
    Publication date: July 17, 2008
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Ying-Chu Lin, Hui-Ying Kuo
  • Circuit board with cooling function
    Publication number: 20080029881
    Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
    Type: Application
    Filed: November 14, 2006
    Publication date: February 7, 2008
    Inventors: Chi-Hao Liang, Xie-Zhi Zhong, Hui-Ying Kuo
  • Chair base
    Patent number: D430982
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: September 19, 2000
    Inventor: Hui-Ying Kuo