Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.

Abstract: An alternating light diode device is provided and includes a substrate, a rectifier and a light emitting diode. The rectifier, a bridge rectifier with four diodes, includes a first alternating terminal and a second alternating terminal receiving an alternating signal and a first electrode and a second electrode outputting a rectified signal. The light emitting diode is electrically connected with the first electrode and the second electrode. Furthermore, the rectifier and the light emitting diode are mounted on the hexagonal star-shaped aluminum substrate wherein the rectifier is arranged around the substrate.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.

Abstract: An alternating light diode device is provided and includes a substrate, a rectifier and a light emitting diode. The rectifier, a bridge rectifier with four diodes, includes a first alternating terminal and a second alternating terminal receiving an alternating signal and a first electrode and a second electrode outputting a rectified signal. The light emitting diode is electrically connected with the first electrode and the second electrode. Furthermore, the rectifier and the light emitting diode are mounted on the hexagonal star-shaped aluminum substrate wherein the rectifier is arranged around the substrate.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.